Bonded Substrate Separation Using a Bernoulli Wafer Handling Step
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Solution Overview
Problem
The existing methods for debonding and handling thin wafers from carrier substrates are inefficient and prone to wafer fragmentation due to manual processes, which can lead to low-quality products and increased risk of damage during the debonding and handling of thin, vulnerable wafers.
Innovation Solution
An automated separation method using a debonding device, a breathable plate, a robot arm, a cleaning device, a relay device with a clamping unit, and a Bernoulli arm to separate and transport the wafer from the carrier substrate, eliminating manual handling and reducing the risk of fragmentation by using a Bernoulli arm to gently lift the wafer from the breathable plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual debonding and handling processes are used, then operational flexibility is maintained, but process efficiency decreases and wafer fragmentation risk increases
Solution Approach 1:
The system performs debonding, cleaning, and wafer separation automatically without manual intervention. The robot arm autonomously transports wafers between devices, the cleaning device automatically cleans wafers, and the Bernoulli arm automatically separates wafers from breathable plates, making the entire process self-sufficient and eliminating manual handling steps.
Solution Approach 2:
The patent replaces manual mechanical handling with automated systems. Specifically, it uses a robot arm for transportation, an automated cleaning device for cleaning, and a Bernoulli arm utilizing aerodynamic principles for wafer separation, thereby substituting human-operated mechanical processes with automated mechanical and aerodynamic systems.
2Reliability
If manual handling of thin wafers is performed, then operational control is maintained, but wafer fragmentation probability increases
Solution Approach 1:
The patent employs a Bernoulli arm that utilizes aerodynamic forces (pneumatics) to gently lift and separate thin wafers from breathable plates. This pneumatic approach provides controlled, contactless handling that minimizes mechanical stress and fragmentation risk while maintaining precise operational control.
Solution Approach 2:
The breathable plate serves as an intermediary carrier between the wafer and the handling system. The wafer is first debonded from the carrier substrate and placed on the breathable plate, then the Bernoulli arm interacts with the breathable plate-wafer assembly, providing a gentle intermediary handling mechanism that protects the fragile wafer.
3Productivity
If automated systems are implemented, then process efficiency improves, but system complexity increases
Solution Approach 1:
The automated system is divided into distinct functional modules: a debonding device for separating wafer from carrier substrate, a robot arm for transportation, a cleaning device for wafer cleaning, and a Bernoulli arm for wafer separation from breathable plate. This segmentation allows each component to perform its specific function independently, simplifying the overall system design and maintenance while maintaining high automation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables fully automated debonding, cleaning, and storage of bonded substrates, significantly improving process efficiency and preventing wafer fragmentation, thus ensuring higher quality and reliability of the wafer handling process.
Implementation Method 1
sucking the wafer by the bernoulli arm to separating the wafer and the breathable plate
Data Source
AI summary
The disclosure is a separation method of bonded substrates. The bonded substrate is placed on a breathable plate of a debonding device to separate a wafer and a carrier substrate of the bonded substrate, and the wafer is placed on the breathable plate. A robot arm moves the wafer and the breathable plate to a cleaning device for cleaning, and then moves the wafer and the breathable plate to a relay device. Clamping units of the relay device clamp the breathable plate, and a bernoulli arm sucks the wafer and separates the wafer and the breathable plate, and then the robot arm transports the wafer and the breathable plate to a storage device respectively. The disclosure can automatically debond and clean the bonded substrate, and automatically move the wafer from the breathable plate, which can avoid the fragmentation of wafer.