Bonded Substrate Edge Trimming via Pulsed Laser Interface Control
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Solution Overview
Problem
Existing substrate processing systems face challenges in effectively separating first substrates from second substrates due to insufficient energy absorption by thin laser absorbing layers, leading to incomplete edge trimming during the bonding process.
Innovation Solution
A substrate processing apparatus with a laser interface radiating unit and a moving mechanism that forms a non-bonding region at the interface between the substrates by controlling the radiation interval of laser light, utilizing a metal film with weaker adhesion to the surface film, allowing for appropriate separation of the first substrate from the second substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser light is radiated to the laser absorbing film to separate substrates, then separation capability is improved, but energy absorption is insufficient when the laser absorbing film is thin
Solution Approach 1:
The patent changes the physical parameters of the laser radiation by introducing a pulse shape with specific pulse width and pulse interval. This allows the laser energy to be delivered in controlled bursts that accumulate heat in the laser absorbing film over time, enabling sufficient energy absorption even from thin films that would otherwise be insufficient with continuous or single-pulse radiation.
Solution Approach 2:
The patent applies periodic laser radiation through pulsed illumination rather than continuous radiation. The pulse train with optimized interval allows thermal energy to accumulate in the laser absorbing film between pulses, creating sufficient temperature rise for effective separation while using less total energy than continuous radiation would require.
2Device complexity
If the laser absorbing film thickness is reduced, then device complexity is reduced, but separation effectiveness deteriorates
Solution Approach 1:
The patent compensates for reduced film thickness by changing the temporal parameters of laser radiation. The pulse width and pulse interval are optimized to match the thermal diffusion characteristics of thinner films, allowing sufficient energy deposition even when the absorbing layer is thin, thus maintaining separation effectiveness while reducing device complexity.
Solution Approach 2:
The patent uses a continuous train of laser pulses rather than single isolated pulses. This continuous periodic action ensures that energy is continuously deposited into the thin laser absorbing film, maintaining effective separation despite the reduced thickness that would otherwise limit energy absorption capacity.
3Reliability
If pulse energy is increased to improve separation, then separation capability is improved, but energy consumption increases
Solution Approach 1:
The patent uses periodic pulsed radiation where multiple lower-energy pulses are delivered in sequence with optimized intervals. The cumulative thermal effect of these pulses achieves the same separation capability as a single high-energy pulse would provide, but with significantly lower total energy consumption and reduced risk of excessive localized heating or damage.
Solution Approach 2:
The patent optimizes the pulse width and pulse interval parameters to maximize energy efficiency. By tuning these temporal parameters to match the thermal response time of the laser absorbing film, the system achieves effective separation with minimal energy waste, converting more of the input energy into useful thermal effects rather than loss through conduction or radiation to surrounding areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient edge trimming and separation of the first substrate from the second substrate, improving throughput and energy efficiency, even with thin laser absorbing films, by forming a non-bonding region at the interface with weaker adhesive strength, ensuring consistent pulse energy and effective separation regardless of substrate thickness.
Implementation Method 1
an interface layer including at least a laser absorbing film
Implementation Method 2
an interface laser radiating unit configured to radiate laser light to the laser absorbing film in a pulse shape
Data Source
AI summary
A substrate processing apparatus configured to process a combined substrate in which a first substrate, an interface layer including at least a laser absorbing film, and a second substrate are stacked on top of each other includes a substrate holder configured to hold the combined substrate; an interface laser radiating unit configured to radiate laser light to the laser absorbing film in a pulse shape; a moving mechanism configured to move the substrate holder and the interface laser radiating unit relative to each other; and a controller. The controller performs a control of acquiring information of the interface layer formed in the combined substrate, and a control of setting, based on the acquired information of the interface layer, a bonding interface having a weakest adhesive strength among bonding interfaces in the interface layer as a separation interface between the first substrate and the second substrate.