Bonded Substrate Gas Analysis for Wafer Bonding Mechanism Detection
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Solution Overview
Problem
Existing technologies lack the capability to analyze the mechanisms of chemical reactions and bonding that occur during the bonding of substrates, such as semiconductor wafers, limiting the understanding of the bonding process.
Innovation Solution
A bonding system and analysis apparatus that modifies the substrate surfaces using plasma processing to facilitate hydrophilization, followed by bonding, and then analyzes the gases released during the separation of bonded substrates to understand the chemical reactions and bonding mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If substrate surfaces are modified using plasma processing to enable bonding, then bonding capability is improved, but ability to analyze bonding mechanism is worsened (no analytical information obtained)
Solution Approach 1:
The patent applies preliminary action by performing plasma surface modification and bonding before analysis. The bonded substrates are prepared in advance, then subjected to separation under controlled conditions to release and analyze the gases that contain information about the bonding mechanism. This allows the bonding process to complete first, preserving the chemical information for subsequent analysis.
Solution Approach 2:
The patent uses gases as intermediaries to transfer information about the bonding mechanism. By detecting gases released during substrate separation, the analysis apparatus indirectly obtains information about the chemical reactions and bonding mechanisms that occurred during the bonding process, without directly observing the bonding interface.
2Strength
If substrates are bonded to form a bonded substrate, then bonding strength is improved, but ability to access and analyze the bonding interface is worsened
Solution Approach 1:
The patent applies inversion by analyzing the bonding interface indirectly through the reverse process of separation. Instead of attempting to directly probe the bonded interface, the method separates the substrates and analyzes the gases released during separation, which contain information about the bonding mechanism. This inverted approach makes the inaccessible interface analyzable.
Solution Approach 2:
The patent uses released gases as intermediaries to access information about the bonding interface. The gases act as carriers that transport chemical information from the bonding interface to the detection system, enabling analysis without direct access to the interface itself.
3Ease of manufacture
If conventional bonding techniques are used, then bonding process is simple, but chemical reaction information is lost
Solution Approach 1:
The patent introduces gas detection as an intermediary measurement system that captures chemical reaction information without complicating the bonding process itself. The bonding remains simple, but the addition of gas analysis during separation provides the lost chemical information about what occurred during bonding.
Solution Approach 2:
The patent implements feedback by using gas analysis results to provide information about the bonding mechanism. The detected gases serve as feedback signals that reveal details about the chemical reactions and bonding processes, enabling optimization and understanding without changing the fundamental bonding procedure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate analysis of the chemical reactions and bonding mechanisms by detecting gases present at the interface of bonded substrates, providing valuable information on the bonding process.
Implementation Method 1
a gas analysis unit (120) that analyzes a component(s) of a gas or gasses G that is/are jetted from between a bonding surface W1j of a first substrate (an upper wafer W1) and a bonding surface W2j of a second substrate (a lower wafer W2)
Implementation Method 2
A bonding system and analysis apparatus that modifies the substrate surfaces using plasma processing to facilitate hydrophilization
Implementation Method 3
bonds both of such hydrophilized substrates due to a van der Waals' force and a hydrogen bond (an intermolecular force)
Data Source
AI summary
An analysis apparatus according to an aspect of the present disclosure includes a substrate holding unit, an insertion unit, and a gas analysis unit. The substrate holding unit holds a bonded substrate where a first substrate and a second substrate are bonded. The insertion unit is capable of being inserted between a bonding surface of the first substrate and a bonding surface of the second substrate in the bonded substrate that is held by the substrate holding unit. The gas analysis unit analyzes a component(s) of a gas or gasses that is/are jetted from between a bonding surface of the first substrate and a bonding surface of the second substrate.