Bonded Substrate Interface Laser Inspection for Clean Edge Removal
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Solution Overview
Problem
Existing substrate processing systems face challenges in uniformly forming a modification layer at the interface between bonded substrates, leading to incomplete removal of the peripheral portion, which can result in particle generation due to axial deviations or non-uniformity of the modification surface.
Innovation Solution
A processing method involving the formation of a non-bonding region with reduced bonding strength at the interface using laser light, followed by inspection with cameras to ensure appropriate formation, and subsequent removal of the peripheral portion starting from a peripheral modification layer, ensuring uniformity and completeness of the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser light is used to form a modification layer at the interface between bonded substrates, then the peripheral portion can be removed, but axial deviations or non-uniformity of the modification surface lead to incomplete removal and particle generation
Solution Approach 1:
The patent introduces an inspection step before the peripheral portion removal to check whether the modification layer has been uniformly formed. This preliminary detection allows the system to identify non-uniformities or axial deviations in the modification layer formation, enabling corrective actions to be taken before the removal process begins, thereby preventing incomplete removal and particle generation
Solution Approach 2:
The patent implements a feedback mechanism where the inspection results of the modification layer are used to control subsequent processing steps. The system detects the forming state of the modification layer and uses this information to adjust or verify the removal process, ensuring that the peripheral portion is completely and uniformly removed without generating particles
2Productivity
If the modification layer is formed quickly, then processing efficiency improves, but uniformity and completeness of the non-bonding region formation may be compromised
Solution Approach 1:
The inspection step is performed as a preliminary action before the peripheral portion removal to verify that the non-bonding region has been completely and uniformly formed. This allows the system to ensure reliability of the modification layer formation without compromising processing efficiency, as the inspection can be quickly performed using optical or other detection methods
Solution Approach 2:
The feedback mechanism ensures that the formation of the non-bonding region is verified for completeness and uniformity before proceeding to the removal step. The inspection results provide real-time feedback on the quality of the modification layer, allowing the system to maintain high reliability while keeping the overall process efficient by avoiding rework or defects later
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise and complete removal of the peripheral portion, reducing the risk of particle generation and improving the efficiency of the substrate processing system by ensuring the non-bonding region is uniformly formed across the entire circumference.
Implementation Method 1
forming, by radiating interface laser light to an interface between the first substrate and the second substrate, a non-bonding region with reduced bonding strength at the interface
Implementation Method 2
imaging the non-bonding region by using a camera; acquiring, from an obtained image of the non-bonding region, a distribution of gray values
Data Source
AI summary
A processing method of processing a combined substrate in which a first substrate and a second substrate are bonded to each other includes: forming, by radiating interface laser light to an interface between the first substrate and the second substrate, a non-bonding region with reduced bonding strength at the interface; inspecting a forming state of the non-bonding region; forming a peripheral modification layer along a boundary between a peripheral portion and a central portion of the first substrate; and removing the peripheral portion starting from the peripheral modification layer. The inspecting of the forming state of the non-bonding region includes: imaging the non-bonding region with a camera; acquiring, from an obtained image of the non-bonding region, a distribution of gray values in a plan view of the non-bonding region; and inspecting the forming state of the non-bonding region by comparing the acquired gray values with a preset threshold value.