Bonded Substrate Misalignment Measurement by Radial Light Transmission
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Solution Overview
Problem
Existing bonded substrates misalignment detection devices face challenges in measuring misalignment amounts between substrates of significantly different sizes without increasing device size and processing complexity, particularly when dealing with large diameter differences.
Innovation Solution
A bonded substrates misalignment measurement device that measures transmission intensity distribution of measurement light in the radial direction using a wavelength suitable for the larger substrate, calculating misalignment based on this distribution, and determining contours using polar coordinates to simplify and enhance accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the edge end position measurement means is increased in size to capture images of both end portions of substrates with large diameter difference, then the measurement capability is improved, but the entire device size increases
Solution Approach 1:
The measurement process is segmented into two independent stages: first measuring the contour of the larger substrate, then measuring the relative edge end positions. This segmentation allows using a smaller measurement means for the second stage, as it only needs to measure relative positions rather than capture the entire large substrate image.
Solution Approach 2:
The invention transitions from a single comprehensive image capture approach to a multi-stage measurement approach that adds temporal dimension. By measuring at different stages (contour first, then relative positions), the system avoids the need for a large measurement means that would be required to capture everything simultaneously.
2Measurement precision
If the edge end position measurement means performs image processing to obtain radius differences, then the measurement precision is improved, but the amount of information to be processed increases
Solution Approach 1:
The invention extracts only the essential information needed for misalignment measurement - the relative edge end positions - rather than processing complete contour data of both substrates. By taking out only the necessary measurement points, the system reduces information processing load while maintaining measurement precision.
Solution Approach 2:
Instead of performing complete image processing on entire substrate contours, the invention applies partial action by measuring only the relative edge end positions at specific locations. This partial measurement approach suffices for determining misalignment without requiring exhaustive processing of all contour information.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces device size and processing complexity while accurately calculating misalignment amounts, enabling precise alignment in semiconductor manufacturing processes.
Implementation Method 1
The measurement light has a wavelength enabling transmission through one of the first substrate and the second substrate that has a larger diameter
Data Source
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Figure 3A~3B
AI summary
The present invention is to bonded substrates misalignment amount measurement device and method for measuring a misalignment amount between two sorts of disc-shaped substrates having different diameter from one another and including a first substrate and a second substrate lying one on another in a thickness direction thereof, and emit measurement light to the bonded substrates in the thickness direction to measure a transmission intensity distribution of the measurement light in a radial direction thereof, and calculate a misalignment amount on the basis of a measurement result. The measurement light has a wavelength enabling transmission through the one of the first substrate and the second substrate that has a larger diameter. The bonded substrates misalignment amount measurement device is used for a semiconductor manufacturing apparatus according to the present invention.