Bonded Substrate Separation and Contact Protection
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Solution Overview
Problem
The existing methods for manufacturing bonded substrates face challenges in ensuring accurate separation along dividing lines without division failures such as cracks, and in preventing contact failures during the application of protective layers on the substrates.
Innovation Solution
A method involving bonding a first and second mother substrate, cutting off a part of the first substrate along a dividing line, forming a communication path, and applying a protective layer while forming a structure in the communication path to prevent the protective layer from reaching the contact terminal, ensuring accurate separation and reducing contact failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a part of the first mother substrate is cut off along the dividing line to form a cutoff portion, then the communication path is created for protective layer material to reach, but this may cause the protective layer material to reach the contact terminal and cause contact failure
Solution Approach 1:
A structure (such as a ridge or barrier) is introduced as an intermediary element within the communication path to block the protective layer material from reaching the contact terminal. This mediator structure allows the communication path to exist for separation purposes while preventing the harmful flow of protective layer material to the contact terminal.
Solution Approach 2:
The communication path is segmented by introducing a structure that divides it into sections. The structure creates a barrier section that blocks the protective layer material while maintaining the overall communication path structure for substrate separation.
2Productivity
If the bonded mother substrate is divided along the dividing line, then separation is achieved, but division failures such as cracks may occur
Solution Approach 1:
A cutoff portion is removed in advance from the first mother substrate along the dividing line before the final separation step. This preliminary action creates a stress relief zone that prevents crack propagation during the subsequent division process, ensuring clean separation without division failures.
Solution Approach 2:
The problematic central portion of the first mother substrate along the dividing line is extracted and removed as a cutoff portion. This extraction eliminates the source of potential cracks and allows for clean separation of the bonded substrates.
Data Source
AI summary
A method for manufacturing a bonded substrate, the method includes: bonding a first mother substrate including a first substrate and a second mother substrate including a second substrate to form a bonded mother substrate; cutting off a part of the first mother substrate along a dividing line of the bonded mother substrate to form a cutoff portion; dividing the bonded mother substrate along the dividing line; separating a bonded substrate from the bonded mother substrate, the bonded substrate including the first substrate and the second substrate bonded to the first substrate; forming a contact terminal on an end portion of the first mother substrate, the contact terminal contactable with an external terminal; forming a communication path between the first mother substrate and the second mother substrate along the dividing line.