Bonded Substrate Separation with Tilt-Controlled Symmetry
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in semiconductor manufacturing is the asymmetric separation of bonded substrates, which can lead to stress concentration and cracking due to uneven separation progress.
Innovation Solution
A separation system with a first chuck to hold the lower substrate, a second chuck to hold and move the upper substrate, an adjuster to adjust the tilt of the second chuck, and a controller to ensure symmetrical separation progress relative to a set line, using sensors and adjusters to maintain uniform stress distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separation progresses along the propagation direction from one substrate to the other, then the substrates can be separated, but asymmetric separation progress causes stress concentration and substrate cracking
Solution Approach 1:
The patent applies asymmetry principle by intentionally introducing a tilt angle between the propagation direction and the normal of the bonding surface. This controlled asymmetry in the separation approach actually achieves symmetric stress distribution and prevents cracking, resolving the contradiction between separation effectiveness and stress concentration prevention
Solution Approach 2:
The patent employs dynamic adjustment of the separation process by controlling the propagation direction to be tilted relative to the bonding surface normal. This dynamic approach allows real-time control of stress distribution during separation, maintaining symmetry and preventing harmful stress concentration while achieving complete substrate separation
2Device complexity
If a simple separation method is used without tilt adjustment, then the device complexity is low, but asymmetric separation progress occurs causing stress concentration
Solution Approach 1:
The patent makes the separation system multi-functional by integrating both separation execution and symmetry control capabilities into a unified approach. The same separation mechanism that propagates the separation also controls the tilt angle, achieving both separation and stress distribution control without adding separate complex subsystems
Solution Approach 2:
The patent changes the geometric parameter of the separation process by introducing a tilt angle between the propagation direction and the bonding surface normal. This parameter change transforms the separation process from a simple normal separation to a controlled tilted separation, achieving symmetric stress distribution while maintaining relatively simple device structure
Data Source
AI summary
According to some embodiments, provided is a separation system configured to separate a bonded substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The separation system includes a first chuck configured to hold the first substrate of the bonded substrate. The separation system includes a second chuck configured to hold the second substrate of the bonded substrate and move the second substrate in a first direction away from a plate surface of the first substrate. The separation system includes an adjuster configured to adjust a tilt of the second chuck with respect to a direction perpendicular to a set line set on a holding surface of the second substrate of the second chuck. The separation system includes a controller configured to operate the adjuster to maintain symmetrical progression of the separation relative to the set line.