Bonded Wafer Separation Using Controlled Twisting Force
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Solution Overview
Problem
The semiconductor industry faces challenges in efficiently de-bonding wafers that have been bonded together for 3DIC packaging, particularly when defects are detected, as existing methods may damage the wafers or require extensive processing time, limiting the reusability of the wafers.
Innovation Solution
A novel system and method utilizing a combination of vacuum and sheer force applied through a mechanical system with a servo motor and ball screw to separate bonded wafers, allowing for precise control of the de-bonding process in a controlled environment, facilitating rework and re-bonding opportunities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional de-bonding methods are used on bonded wafers, then the wafers can be separated, but the wafers may be damaged or require extensive processing time
Solution Approach 1:
The patent applies controlled parameter changes by gradually increasing the twisting force applied to the bonded wafer interface. The system starts with minimal force and incrementally increases it until de-bonding occurs, allowing the wafer to separate cleanly without damage. This controlled parameter progression ensures both speed and wafer integrity are maintained.
2Reliability
If extensive processing time is spent on de-bonding, then wafer damage may be reduced, but productivity decreases
Solution Approach 1:
The patent employs preliminary action by applying a controlled twisting force that gradually increases before the actual de-bonding event. This preliminary application of force prepares the bonded interface for clean separation, preventing sudden violent separation that could damage the wafers. The gradual force application optimizes both speed and integrity.
3Productivity
If high force is applied to separate bonded wafers quickly, then productivity increases, but wafer damage occurs
Solution Approach 1:
The patent applies dynamics by implementing a dynamic, gradually increasing force regime rather than a static high-force application. The twisting force evolves over time, starting low and increasing incrementally until de-bonding occurs. This dynamic approach allows the system to adapt to the actual bonding strength, achieving fast de-bonding without applying excessive force that could damage the wafers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and damage-free separation of bonded wafers, allowing for rework and re-bonding, thereby increasing yield and reducing costs by applying a controlled twisting force and maintaining ambient pressure levels similar to bonding conditions.
Implementation Method 1
means for applying a vacuum to the bonded wafers
Data Source
AI summary
Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.