Bonding Abnormality Detection in Electronic Devices
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Solution Overview
Problem
Conventional electronic devices face inefficiencies in detecting abnormalities in the bonding portion between electronic components and substrates, particularly due to thermal stress leading to cracks and failures, which existing methods fail to address effectively.
Innovation Solution
The electronic device incorporates a measurement unit to detect changes in the electrical resistance of a thin bonding portion adjacent to a corner of the electrical component, which is inclined relative to the substrate, allowing for earlier detection of defects and reducing the likelihood of thermal fatigue by separating the bonding material into thin and thick parts with a gap, enabling efficient abnormality determination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional bonding structure is used with uniform bonding material distribution, then the manufacturing process is simple, but the detection of bonding abnormalities is inefficient and thermal stress causes cracks and failures
Solution Approach 1:
The bonding material is segmented into different thickness regions (thin bonding portion and thick bonding portion) by dividing the bonding area. This segmentation allows the thin portion to serve as a stress release zone that prevents thermal fatigue cracks while enabling effective abnormality detection through resistance measurements, thus improving reliability without excessive complexity
Solution Approach 2:
Different regions of the bonding material are given different local qualities - the thin bonding portion has reduced thickness to release thermal stress and prevent cracks, while the thick bonding portion maintains adequate bonding strength. This local differentiation allows the system to simultaneously achieve crack prevention and effective abnormality detection
2Measurement precision
If multiple measurement units are used to detect bonding abnormalities, then the detection accuracy improves, but the number of components and device complexity increases
Solution Approach 1:
The measurement unit is designed to perform multiple functions: it measures electrical resistance to detect bonding abnormalities, and by strategically positioning a single measurement unit, it can detect issues in both the thin and thick bonding portions. This multi-functionality approach maintains high detection accuracy while minimizing the number of measurement units required
Solution Approach 2:
The measurement unit is positioned in advance to optimally detect resistance changes in the thin bonding portion, which is the critical region for abnormality detection. This preliminary positioning ensures that a single measurement unit can effectively monitor the bonding status without requiring multiple units, thus maintaining measurement precision while reducing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables more accurate and efficient detection of bonding material abnormalities, allowing for proactive measures before failure occurs, while reducing the number of measurement units and improving design flexibility.
Implementation Method 1
an electronic component which detects an abnormality of a bonding portion between the electronic component and a substrate based on a change in an electrical resistance
Data Source
AI summary
According to one embodiment, an electronic device comprises a circuit board, an electrical component, and a measurement unit. The circuit board has a first face. The electrical component includes a second face electrically connected to the first face via a bonding material, a first end in a first direction along the second face, and a second end. The second end is opposite to the first end in the first direction. The measurement unit is configured to measure a characteristic changing depending on a conductivity of the bonding material. A first distance between the first face and the first end is shorter than a second distance between the first face and the second end. The measurement unit includes a first measurement unit configured to measure the characteristic of a part of the bonding material. The part is adjacent to the first end.