Bonding Apparatus Alignment Correction via Operation Data

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Solution Overview

Problem

The existing chip bonding process is inefficient due to the time-consuming correction procedures using vision units, which delay the bonding process in semiconductor manufacturing.

Innovation Solution

A bonding apparatus and method that utilize a control part to determine and correct the movement distance of a bonding unit based on a weighted sum of continuous operations and idle time, using a linear regression equation, to quickly and accurately align the bonding unit with the substrate, thereby improving bonding efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a vision unit is used to check and correct the bonding head alignment, then the bonding precision is improved, but the bonding time is increased

Engineering Contradiction:
Improvebonding alignment precisionVSAvoidbonding speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The system performs preliminary actions by recording operation data (number of continuous operations and idle time) during the bonding process, and pre-calculates movement distance corrections using linear regression equations. This preparation work is done in advance so that when bonding occurs, the corrected position can be applied directly without time-consuming vision unit intervention, thus resolving the contradiction between precision and speed.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system implements feedback by using post-bonding inspection results to continuously update and correct the linear regression equation parameters. The inspection data feeds back into the system to refine the movement distance calculations, improving precision over time without requiring vision unit correction during each bonding operation, thereby maintaining high productivity.

Inventive Principle:
Principle #23Feedback

2Speed

If the bonding unit moves to the bonding position using traditional positioning, then the positioning speed is maintained, but the positioning accuracy deteriorates due to thermal expansion

Engineering Contradiction:
Improvebonding unit movement speedVSAvoidbonding position accuracy
Core Design Contradiction:
SpeedVSManufacturing precision

Solution Approach 1:

The system changes the parameter used for positioning from simple count-based movement to a corrected movement distance that accounts for thermal expansion effects. By using linear regression equations that incorporate operation data (continuous operations count and idle time), the system calculates compensated movement distances that adjust for thermal drift, maintaining both speed and precision.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The system replaces the traditional mechanical positioning system (which relies solely on motor steps and physical encoders) with a computational correction system. The linear regression-based calculation substitutes for physical measurement and correction mechanisms, using mathematical models to predict and compensate for thermal expansion effects, thereby maintaining accuracy without mechanical complexity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS11705426B2Bonding apparatus and bonding method
Publication Date: 2023.07.18 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US11705426B2 patent drawing
  • US11705426B2 patent drawing
  • US11705426B2 patent drawing

AI summary

A bonding apparatus includes a stage on which a substrate is seated, a gantry installed above the stage, a bonding unit configured to bond a chip to the substrate while moving along the gantry, and a control part moving the bonding unit to align the bonding unit with a bonding position on the substrate, controlling the bonding unit to allow the bonding unit to bond the chip at the bonding position, determining a movement distance of the bonding unit based on a weighted sum of a number of continuous operations and an idle time of the bonding unit.