Substrate Bonding Alignment With Interferometer Gas Stabilization
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Solution Overview
Problem
The challenge in three-dimensional integration of semiconductor devices is the need for improved bonding precision between substrates to minimize positional deviation and reduce wiring resistance and delay.
Innovation Solution
A bonding apparatus and method that utilizes a first and second holder to attract and hold substrates, a moving unit to adjust positional alignment, and interferometers to measure horizontal distances, with a second gas supply to stabilize light measurement and enhance precision by controlling temperature and gas flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If interferometer is used to measure horizontal distance for substrate alignment, then measurement precision is improved, but measurement accuracy deteriorates due to temperature and atmospheric fluctuations
Solution Approach 1:
A temperature control unit is introduced as an intermediary between the interferometer and the environment. This unit actively regulates the temperature within the housing to maintain a stable measurement environment, thereby eliminating temperature fluctuations that cause refractive index changes in air and subsequent measurement errors. The intermediary device (temperature control unit) protects the measurement system from external thermal disturbances.
Solution Approach 2:
The patent changes the temperature parameter within the housing from a variable state to a controlled constant state. By actively regulating temperature and maintaining it at a set point, the system eliminates temperature-induced variations in air density and refractive index, thereby stabilizing the optical path length and improving measurement reliability without sacrificing precision.
2Productivity
If three-dimensional integration technique is used to meet high integration demand, then productivity is improved, but bonding precision deteriorates due to positional deviation
Solution Approach 1:
The system employs a feedback mechanism where the interferometer continuously measures the horizontal distance between substrates, and this measurement information is fed back to the moving unit. The moving unit adjusts the substrate positions based on this feedback to achieve precise alignment. This closed-loop control ensures high bonding precision while maintaining efficient three-dimensional integration processes.
Solution Approach 2:
The patent replaces manual or simple mechanical alignment methods with an optical measurement system (interferometer) combined with automated control. The interferometer provides non-contact, high-precision measurement of horizontal distances, and the control system automatically adjusts positions, eliminating the need for complex mechanical alignment mechanisms and improving both precision and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances bonding precision by reducing measurement errors due to temperature and atmospheric fluctuations, thereby improving the alignment and integration of semiconductor devices.
Implementation Method 1
The interferometer is disposed within the housing and radiates light to the first one or an object moved along with the first one to measure a horizontal distance to the first one or the object
Implementation Method 2
The second gas supply is configured to supply a second gas to a space between the interferometer and the first one or the object to which the light is radiated
Data Source
AI summary
A bonding apparatus includes a first holder, a second holder, a moving unit, a housing, an interferometer, a first gas supply and a second gas supply. The first holder is configured to attract and hold a first substrate. The second holder is configured to attract and hold a second substrate. The moving unit is configured to move a first one of the first holder and the second holder in a horizontal direction with respect to a second one thereof. The interferometer is configured to radiate light to the first one or an object moved along with the first one to measure a horizontal distance thereto. The first gas supply is configured to supply a clean first gas to an inside of the housing. The second gas supply is configured to supply a second gas to a space between the interferometer and the first one or the object.