Bonding Alignment Estimation Using External Pattern Features
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Solution Overview
Problem
Existing bonding technologies face challenges in accurately determining the relative position between patterns on bonded members post-bonding, as the bonding surfaces cannot be easily checked from the outer appearance, making it difficult to ensure precise alignment and positioning.
Innovation Solution
A bonding apparatus equipped with first and second image capturing devices and a controller that captures images of the bonding surfaces, aligns the members based on pattern positions, and estimates the relative position between patterns post-bonding using feature position information and pre-obtained positional relationship information.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If bonding surfaces are checked from outer appearance, then inspection is simple, but relative position between patterns cannot be obtained
Solution Approach 1:
The patent introduces a feature portion (such as a mark or reference structure) as an intermediary element that can be observed from the outer appearance but is positionally related to the pattern. By capturing images of this feature portion and using the stored positional relationship information between the feature portion and the pattern, the system indirectly obtains pattern position information without directly observing the bonding surface patterns.
2Ease of operation
If bonding surfaces are checked from outer appearance, then inspection is easy, but bonding quality determination is insufficient
Solution Approach 1:
The feature portion serves as a mediator that provides externally visible information correlated with the bonding quality. By imaging the feature portion and comparing its position against the stored positional relationship information, the system can infer bonding quality and pattern alignment without directly examining the bonding interface.
3Manufacturing precision
If relative position is measured after bonding, then alignment accuracy can be verified, but measurement becomes difficult due to inaccessible bonding surfaces
Solution Approach 1:
The patent uses the feature portion as an accessible intermediary that proxies for the inaccessible pattern position. The feature portion is positioned such that it can be imaged from the outer appearance, and its measured position is translated into pattern position information using pre-stored positional relationship data, thereby enabling indirect measurement of alignment accuracy.
Solution Approach 2:
The system creates a positional copy or representation of the pattern information through the feature portion. By storing the positional relationship between the feature portion and the pattern in advance, the feature portion effectively becomes a copy that carries position information, allowing measurement without direct access to the original pattern.
Data Source
AI summary
The present invention provides a bonding apparatus for bonding, to a first member including a first bonding surface on which a first pattern is provided, a second member including a second bonding surface on which a second pattern is provided, comprising: a first image capturing device configured to capture an image of the first bonding surface; a second image capturing device configured to capture an image of the second bonding surface; and a controller configured to control a bonding process of aligning the first member and the second member based on a position of the first pattern obtained from the captured image by the first image capturing device and a position of the second pattern obtained from the captured image by the second image capturing device, and bonding the second member to the first member.