Bonding Apparatus Dual Transport Path Overlap
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Solution Overview
Problem
Conventional bonding apparatuses are unable to handle both rectangular and circular substrates efficiently, requiring separate apparatuses for each shape, leading to increased space and cost burdens.
Innovation Solution
A bonding apparatus with a dual transport mechanism that can partially overlap its transport paths to accommodate both rectangular and circular substrates, allowing for switching between substrate types and minimizing space requirements, featuring a planar transport unit for rectangular substrates and an arm transport unit for circular substrates, with an adapter system for versatile substrate handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate bonding apparatuses are prepared for rectangular and circular substrates, then each substrate type can be handled with dedicated transport mechanisms, but the installation space and cost burden increase significantly
Solution Approach 1:
The bonding apparatus is designed with a universal transport mechanism that can handle both rectangular and circular substrates. The arm transport unit with adjustable suction members can adapt to different substrate shapes, eliminating the need for separate dedicated apparatuses and reducing installation space while maintaining full substrate handling capability
Solution Approach 2:
The transport mechanism incorporates dynamic adjustability through movable arm positions and reconfigurable suction member arrangements. This allows the same apparatus to dynamically adapt its configuration for different substrate types (rectangular or circular), providing versatility without requiring multiple fixed dedicated systems
2Adaptability or versatility
If separate bonding apparatuses are prepared for rectangular and circular substrates, then each substrate type can be handled with dedicated transport mechanisms, but the cost burden increases significantly
Solution Approach 1:
A single bonding apparatus is designed to perform both rectangular and circular substrate bonding through a universal arm transport mechanism. This eliminates the need to manufacture and purchase two separate dedicated apparatuses, significantly reducing the cost burden while maintaining full adaptability to handle both substrate types
3Area of stationary object
If transport paths for rectangular and circular substrates are made to overlap, then the apparatus size is reduced, but the transport mechanisms may interfere with each other
Solution Approach 1:
The arm transport unit incorporates dynamic position control that allows it to adaptively adjust its movement path based on the substrate type being processed. When handling rectangular substrates, the arm follows one trajectory; when handling circular substrates, it follows another. This dynamic path adjustment enables overlapping transport paths while preventing interference between different substrate handling operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves miniaturization and versatility, enabling efficient bonding of both rectangular and circular substrates while reducing space and cost, and allowing for flexible operation between different substrate handling methods.
Implementation Method 1
the rectangular substrate is transported by being sucked and held with an arm having a suction member
Data Source
AI summary
A bonding apparatus includes a bonding stage on which either a rectangular substrate or a circular substrate can be installed; a first transport mechanism which transports the rectangular substrate from a first carry-in unit to the bonding stage and from the bonding stage to a first carry-out unit; and a second transport mechanism which transports the circular substrate from a second carry-in/out unit to the bonding stage and from the bonding stage to the second carry-in/out unit, in which a first transport path determined by the first transport mechanism and a second transport path determined by the second transport mechanism partially overlap.