Semiconductor Bonding Apparatus with Elastic Holding Mechanism
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Solution Overview
Problem
In semiconductor manufacturing, large and thin semiconductor substrates are prone to warpage or cracking during transfer and polishing, and existing bonding methods using support substrates like glass face challenges in maintaining precise alignment due to thermal expansion and misalignment issues.
Innovation Solution
A bonding apparatus with a first and second holding unit, each equipped with heating mechanisms, a pressing mechanism to contact and press the substrates, and an elastic holding mechanism to prevent misalignment, using electrostatic adsorption and biasing members to securely hold the substrates and manage thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heating mechanisms are provided in holding units to bond substrates, then bonding temperature can be controlled, but thermal expansion causes misalignment between substrates
Solution Approach 1:
The holding units are designed to be movable relative to each other along the surface where substrates are held. This dynamic adjustment capability allows the system to compensate for thermal expansion by dynamically repositioning the holding units, thereby maintaining alignment precision even when temperature changes cause expansion.
Solution Approach 2:
The system changes the positional parameter of the holding units dynamically. By adjusting the position of holding units in response to thermal expansion, the system maintains proper alignment between substrates while still achieving the required bonding temperature.
2Manufacturing precision
If holding units are rigidly fixed to prevent misalignment, then alignment precision is improved, but thermal expansion causes damage to the holding units
Solution Approach 1:
Instead of rigid fixation, the holding units are designed with movable capabilities that allow them to adjust their positions dynamically. This prevents the accumulation of thermal stress that would occur with rigid fixation, thereby avoiding damage while still maintaining alignment precision through controlled movement.
Solution Approach 2:
The system explicitly accounts for thermal expansion by designing holding units that can move to accommodate expansion. Rather than resisting expansion through rigid fixation, the system allows controlled movement that prevents damage while maintaining positioning accuracy.
3Strength
If holding units are made movable to tolerate thermal expansion, then holding unit integrity is maintained, but misalignment may occur
Solution Approach 1:
The system incorporates feedback mechanisms that monitor the position and state of holding units. This feedback enables real-time adjustments to maintain alignment precision while allowing the holding units to move and accommodate thermal expansion, thus resolving the contradiction between movability and precision.
Solution Approach 2:
The movable holding units are equipped with control mechanisms that dynamically adjust their positions based on real-time conditions. This dynamic control ensures that while the units can move to tolerate thermal expansion, they maintain precise alignment throughout the bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses misalignment and warpage, ensuring precise bonding of semiconductor substrates while tolerating thermal expansion, thereby preventing damage to the holding units and maintaining substrate integrity.
Implementation Method 1
The first holding unit is provided with a first heating mechanism and holds a first substrate. The second holding unit disposed facing the first holding unit and provided with a second heating mechanism, holds a second substrate.
Implementation Method 2
The pressing mechanism relatively moves the first holding unit and the second holding unit in order to contact and press the first substrate and the second substrate.
Implementation Method 3
The holding mechanism elastically holds an outer periphery of the first holding unit and the second holding unit.
Data Source
AI summary
A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a pressing mechanism and a holding mechanism. The first holding unit is provided with a first heating mechanism and holds a first substrate. The second holding unit disposed facing the first holding unit and provided with a second heating mechanism, holds a second substrate. The pressing mechanism relatively moves the first holding unit and the second holding unit in order to contact and press the first substrate and the second substrate. The holding mechanism elastically holds an outer periphery of the first holding unit and the second holding unit.