Room Temperature Bonding Apparatus with Gas Exhaust Flow Passage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current room temperature bonding apparatuses face challenges in preventing substrate misalignment, pollution, atmospheric pollution, high manufacturing costs, maintenance complexity, damage to substrates, and the ability to handle thinner and varied substrate shapes during the bonding process.
Innovation Solution
The apparatus incorporates a load lock chamber with a cartridge featuring an island portion and flow passages to prevent gas-induced substrate movement, a conveyer unit with hand and stage positioning sections for precise handling, and an imaging unit for accurate alignment, along with a bonding chamber design that allows for non-contact substrate handling and pressure reduction to prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the internal space of the load lock chamber is pressure-reduced, then the bonding quality is improved, but the substrate may move due to gas pressure differential
Solution Approach 1:
The flow passage is pre-formed in the cartridge before the bonding process. This preliminary structural design enables gas to be exhausted from the space between the substrate and cartridge, preventing substrate movement during pressure reduction while maintaining bonding quality.
Solution Approach 2:
The flow passage acts as an intermediary channel that mediates between the pressure differential (which improves bonding) and substrate stability (which requires preventing movement). By providing a controlled gas exhaust path, it allows pressure reduction to proceed while maintaining substrate position.
2Ease of operation
If direct contact handling is used for substrates, then handling is simplified, but substrate pollution and damage occur
Solution Approach 1:
The cartridge serves as an intermediary handling tool between the operator and the substrate. Instead of direct contact, the substrate is placed on the cartridge which then transports it to the bonding chamber. This intermediary approach simplifies handling while preventing substrate pollution.
3Manufacturing precision
If complex positioning mechanisms are added, then alignment accuracy is improved, but device complexity and cost increase
Solution Approach 1:
Positioning sections are pre-formed on the cartridge before the bonding process. This preliminary positioning setup ensures accurate substrate alignment without requiring complex real-time adjustment mechanisms during bonding, thereby maintaining alignment accuracy while reducing mechanism complexity.
4Ease of manufacture
If traditional bonding apparatus design is used, then manufacturing is straightforward, but maintenance is complex and costly
Solution Approach 1:
The bonding apparatus is segmented into modular components: the cartridge, the load lock chamber, and the bonding chamber. The cartridge can be easily removed and replaced, simplifying maintenance. This segmentation maintains manufacturing straightforwardness while significantly improving ease of repair.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the accuracy and reliability of substrate bonding, reduces manufacturing costs, simplifies maintenance, and enables the handling of thinner and varied substrate shapes while preventing pollution and damage.
Implementation Method 1
a flow passage formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. A gas filled in a space between the cartridge and the substrate is exhausted outside through the flow passage when the internal space of the load lock chamber is pressure-reduced.
Data Source
AI summary
A room temperature bonding apparatus according to the present invention is provided with a load lock chamber having an internal space which is pressure-reduced; and a cartridge arranged in the load lock chamber. The cartridge includes an island portion formed to contact a substrate when the substrate is put on the cartridge. A flow passage is formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. Therefore, in the room temperature bonding apparatus can prevent making the substrate is moved to the cartridge due to gas when the internal space is pressure-reduced.