Bonding Apparatus Pusher Mechanism for Wafer Alignment

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Solution Overview

Problem

Existing bonding technologies face challenges in achieving reliable bonding of substrates without strain, as substrates may deflect due to their weight or warping, leading to misalignment and reduced bonding strength, especially when pushing from above or using deformable configurations.

Innovation Solution

A bonding apparatus that includes a pusher to lift and push a prescribed point on the back surface of a substrate, with a substrate support unit holding the circumferential edge of another substrate, allowing for precise alignment and contact at a point where the distance between bonding surfaces is minimized, reducing strain and ensuring consistent bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the circumferential edge portion of the second substrate is held and bonding is performed by pushing from above, then bonding can be achieved, but the substrate deflects due to its own weight causing large deflection and strain

Engineering Contradiction:

Improvebonding reliabilityVSAvoidsubstrate alignment precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

Instead of pushing the second substrate from above, the invention pushes the first substrate from below. This inversion of the pushing direction eliminates substrate deflection and strain while achieving reliable bonding, as the push force is applied in a direction that does not cause the substrate to bend under its own weight.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The invention changes the dimension of force application from vertical (pushing from above) to horizontal (pushing from below). By applying the push force in the horizontal direction rather than vertically downward, the substrate avoids bending moments and deflection that occur when pushed from above, thereby maintaining alignment precision.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of operation

If the wafer is deformed in a protruding configuration to conform to the rubber chuck, then contact with the bonding surface is achieved, but strain may occur in the wafer

Engineering Contradiction:

Improvesubstrate contact achievementVSAvoidwafer strain

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

Instead of deforming the wafer to conform to the chuck, the invention inverts the approach by pushing the substrate from below in a direction that maintains its flat configuration. This eliminates the need for warping or protruding deformation, thereby avoiding strain while still achieving proper contact during bonding.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The invention performs preliminary positioning and alignment before bonding by holding the circumferential edge portion and pushing from below. This preliminary action ensures proper contact and alignment is achieved without requiring the substrate to be deformed into a protruding configuration, thus preventing strain occurrence.

Inventive Principle:

Principle #10Preliminary action

3Force

If the substrate is pushed from above, then bonding force is applied, but the deflection of the substrate becomes large causing misalignment

Engineering Contradiction:

Improvebonding force applicationVSAvoidsubstrate alignment

Core Design Contradiction:

ForceVSManufacturing precision

Solution Approach 1:

The invention applies bonding force by pushing from below rather than from above. This inversion maintains effective bonding force application while eliminating the deflection and misalignment problems caused by pushing from above, as the force is applied in a direction that does not create bending moments.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The bonding force is applied in a different dimension - horizontally from below instead of vertically from above. This dimensional change allows the bonding force to be effectively transmitted without causing substrate deflection, thereby maintaining alignment precision while still achieving the necessary bonding force.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9586391B2Bonding apparatus and method for manufacturing bonded substrate

Publication Date: 2017.03.07 SHIBAURA MECHATRONICS CORP

AI summary

A bonding apparatus includes a substrate holder holding the second substrate; a pusher pushing a back surface of the second substrate; a substrate support unit including a support talon supporting a circumferential edge portion of the first substrate to oppose the second substrate with a prescribed spacing between the second substrate and the circumferential edge portion of the first substrate; and a controller controlling a lifting/lowering operation of the pusher. The pusher pushes one prescribed point of the back surface of the second substrate, the one prescribed point corresponding to a position where a distance between a bonding surface of the first substrate and a bonding surface of the second substrate is shorter than a distance from the circumferential edge portion of the bonding surface of the first substrate to the bonding surface of the second substrate.