Bonding Apparatus with Segmented Suction for Substrate Alignment
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Solution Overview
Problem
Existing bonding technologies face challenges in achieving precise and accurate bonding of substrates, particularly in suppressing distortions and improving bonding accuracy, due to limitations in controlling attracting forces and substrate alignment during the bonding process.
Innovation Solution
A bonding apparatus with a first holder and second holder, each equipped with transforming devices to adjust the substrates' positions, and a suction device generating different attracting forces in multiple division regions, controlled by a device to optimize substrate alignment and contact for precise bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single uniform suction force is applied to hold the substrate, then the substrate can be securely held, but substrate distortion occurs and bonding accuracy deteriorates
Solution Approach 1:
The suction device divides the attraction region into multiple division regions (first, second, third, and fourth division regions) and applies different suction forces to each region. This segmentation allows independent control of suction force in each region, enabling suppression of substrate distortion while maintaining secure holding.
Solution Approach 2:
Different suction forces are applied to different regions of the substrate based on their specific requirements. The first and second division regions receive different suction forces than the third and fourth division regions, creating local quality variations that suppress distortion and improve bonding accuracy.
2Stability of the object's composition
If strong suction force is applied to hold the substrate firmly, then substrate positioning stability improves, but substrate distortion increases and bonding precision worsens
Solution Approach 1:
The suction device dynamically adjusts the suction force in each division region independently. By making the suction force adjustable and region-specific, the system can optimize the balance between holding stability and distortion suppression, improving bonding precision without sacrificing positioning stability.
Solution Approach 2:
The suction force parameter is changed across different division regions, with each region having its own suction force level. This parameter variation allows the system to maintain substrate positioning stability while reducing distortion through optimized local suction forces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances bonding accuracy by suppressing substrate distortions and improving the precision of bonding, allowing for effective intermolecular force-based bonding of substrates, resulting in a more reliable and precise combined substrate.
Implementation Method 1
a suction device configured to generate different attracting forces in multiple division regions included in an attraction region of the second substrate
Implementation Method 2
a first transforming device configured to transform the first substrate held by the first holder such that a central portion of the first substrate is protruded downwards
Implementation Method 3
a second transforming device configured to transform the second substrate held by the second holder such that a central portion of the second substrate is protruded upwards
Implementation Method 4
allowing for effective intermolecular force-based bonding of substrates
Data Source
AI summary
A bonding apparatus includes a first holder, a first transforming device, a second holder, a second transforming device, a suction device and a control device. The first holder attracts and holds a first substrate from above. The first transforming device transforms the first substrate held by the first holder such that a central portion of the first substrate is protruded downwards. The second holder is provided under the first holder, and attracts and holds a second substrate, which is to be bonded to the first substrate, from below. The second transforming device transforms the second substrate held by the second holder such that a central portion of the second substrate is protruded upwards. The suction device generates different attracting forces in multiple division regions included in an attraction region of the second substrate. The control device controls the suction device.