Bonding Apparatus Real-Time Tilt Adjustment
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Solution Overview
Problem
Conventional bonding methods for semiconductor devices are time-consuming and inaccurate in adjusting the tilt of electrical components relative to base members, leading to misalignment and compromised yield due to offline tilt correction and variations in component thicknesses.
Innovation Solution
A bonding apparatus with sensors to measure reaction forces and actuators to adjust bond forces in real-time, ensuring precise alignment of electrical components with base members during the bonding process, using a mechanism that includes holding element actuators, sensors, and bond force adjusting actuators to determine and exert forces for optimal contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional offline tilt detection and correction methods are used, then tilt measurement capability is provided, but manufacturing time increases and productivity decreases
Solution Approach 1:
The bonding apparatus performs self-diagnosis and self-correction by using its own bonding actuators to detect tilt through reaction forces and automatically adjust bond force distribution, eliminating the need for separate offline calibration tools and processes
Solution Approach 2:
The tilt detection function is merged with the bonding process itself by using the bonding actuators to apply forces that generate measurable reaction forces, combining measurement and processing operations into a single integrated system
2Measurement precision
If calibration tools are used to measure tilt extent, then tilt measurement is possible, but measurement accuracy is compromised due to variations in component thicknesses
Solution Approach 1:
The system uses real-time feedback from reaction force sensors during the bonding process to detect actual tilt conditions, automatically adjusting for variations in component thicknesses without requiring pre-calibration
Solution Approach 2:
The system changes the measurement approach from geometric measurement (which is sensitive to thickness variations) to force-based measurement, where the reaction forces directly indicate tilt regardless of component dimensional variations
3Manufacturing precision
If bond head tilt is corrected offline before bonding, then initial alignment is improved, but the correction process is time-consuming and affects yield
Solution Approach 1:
The system performs preliminary tilt detection and correction actions during the bonding process itself rather than requiring separate offline calibration steps, achieving alignment correction as part of the normal manufacturing flow
Solution Approach 2:
The bonding apparatus maintains continuous operation by detecting and correcting tilt during the bonding process without interrupting production flow, eliminating idle calibration time between manufacturing steps
Data Source
AI summary
A bonding apparatus includes a holding element, holding element actuators, sensors, a controller and bond force adjusting actuators. In use, the holding element holds an electrical component and is moved by the holding element actuators in one or more actuating directions to contact the electrical component with a base member. The sensors measure reaction forces exerted on the holding element in response to contact between the electrical component and the base member. The controller determines bond forces to be exerted on actuating areas of the holding element during a bonding process based on the measured reaction forces, and the bond force adjusting actuators exert these bond forces on the actuating areas of the holding element during the bonding process, so as to adjust a tilt of the electrical component relative to the base member.