Wire Bonding Base Segmentation for Imaging Vibration Isolation
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Solution Overview
Problem
In wire bonding, external vibration during the bonding process degrades the bondability of the bonding wire, affecting the reliability of the bonding process.
Innovation Solution
A wire bonding apparatus is designed with the wire bonding unit and imaging unit attached to different portions of the base, isolating the wire bonding unit from vibrations caused by the imaging unit's operations, and incorporating an optical system with separate imaging paths for calibration and bonding target imaging to ensure precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the imaging unit and wire bonding unit are attached to the same base, then the device structure is simplified, but vibration from the imaging unit degrades the bondability
Solution Approach 1:
The base is divided into a first base and a second base, with the wire bonding unit attached to the first base and the imaging unit attached to the second base. This segmentation isolates the vibration sources, preventing imaging unit vibrations from affecting the wire bonding unit's bondability while maintaining a relatively simple overall device structure.
2Measurement precision
If the imaging unit operates with high precision, then positioning accuracy is improved, but vibration is generated that affects wire bonding quality
Solution Approach 1:
The imaging unit is extracted from the wire bonding unit and mounted on a separate second base. This extraction removes the harmful vibration effect from the wire bonding process while preserving the high positioning accuracy capability of the imaging unit for capturing bonding images and analyzing bonding quality.
Data Source
AI summary
A wire bonding apparatus is provided with: a bonding stage on which a semiconductor chip is mounted; a wire bonding unit including a capillary bonding a bonding wire to the semiconductor chip, a Z-axis drive section reciprocating the capillary, and a tool XY-stage causing the capillary and the Z-axis drive section to be moved along a two-dimensional plane intersecting a direction of reciprocation; and a base having an optical system and an optical system XY-stage causing the optical system to be moved along a two-dimensional plane intersecting a direction of reciprocation, the base having the wire bonding unit attached thereto. The wire bonding unit is attached to a first portion of the base, and the optical system XY-stage is attached to a second portion of the base which is separate from the first portion.