Bonding Mother Substrates with Buffer Sheet for Display Manufacturing
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Solution Overview
Problem
The existing display device manufacturing method requires multiple steps, including resin layer removal and severing from glass substrates, which reduces production efficiency.
Innovation Solution
A method involving the formation of resin layers and light-emitting layers on mother substrates, followed by encapsulating layers, bonding with a buffer sheet, peeling, and bonding support films to improve efficiency and yield, while minimizing damage to the layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If resin layer removal and severing steps are performed for each glass substrate, then individual organic EL display portions can be obtained, but production efficiency is reduced
Solution Approach 1:
Multiple glass substrates are bonded together with buffer sheets interposed between them, allowing resin layers and light-emitting layers to be formed integrally across multiple substrates simultaneously. This merging approach enables batch processing of multiple substrates through subsequent peeling and severing steps, significantly improving production efficiency while reducing the number of processing steps required per substrate
2Productivity
If multiple processing steps are performed for each substrate, then complete manufacturing is achieved, but production time increases
Solution Approach 1:
Buffer sheets are interposed between glass substrates before resin layer formation, enabling preliminary bonding of multiple substrates. This preliminary action allows subsequent resin layer formation, peeling, and severing to be performed on multiple substrates simultaneously as a batch, rather than sequentially on each substrate, thereby reducing total processing time and increasing manufacturing speed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances production efficiency by allowing integral formation and peeling of resin and light-emitting layers, providing sufficient strength and reducing damage, thus improving the overall yield and cost-effectiveness of display device production.
Implementation Method 1
bonding the first mother substrate and the second mother substrate with a buffer sheet interposed between the first mother substrate and the second mother substrate
Implementation Method 2
forming, on the first light-emitting layer, a first encapsulating layer encapsulating the first light-emitting layer
Data Source
AI summary
A display device manufacturing method according to the disclosure includes the steps of forming a first resin layer serving as a first flexible substrate on a first mother substrate, forming a first light-emitting layer on the first resin layer, and forming, on the first light-emitting layer, a first encapsulating layer encapsulating the first light-emitting layer, forming a second resin layer serving as a second flexible substrate on a second mother substrate, forming a second light-emitting layer on the second resin layer, and forming, on the second light-emitting layer, a second encapsulating layer encapsulating the second light-emitting layer, bonding the first mother substrate and the second mother substrate with a buffer sheet interposed between the first mother substrate and the second mother substrate so that the first encapsulating layer and the second encapsulating layer face each other, peeling the first resin layer from the first mother substrate in a state where the first resin layer and the second resin layer are layered with the buffer sheet interposed between the first resin layer and the second resin layer, and bonding a first support film to the first resin layer.