Transformation Plate Bonding Chuck for Substrate Alignment Stability
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Solution Overview
Problem
The existing substrate bonding processes for semiconductor manufacturing often result in permanent physical transformation of substrates, leading to reduced reliability and increased misalignment of bonding pads, which affects the packaging density and performance of semiconductor devices.
Innovation Solution
A substrate bonding apparatus with a first and second bonding chuck, where the first bonding chuck includes a transformation plate with a recess groove and protrusion, allowing for adjustable distance and pressure distribution to minimize substrate transformation, and a method involving alignment, transformation, and controlled bonding to suppress permanent substrate transformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrate bonding process is used, then bonding between substrates is achieved, but permanent physical transformation of substrates occurs leading to reduced reliability
Solution Approach 1:
A transformation plate is introduced as an intermediary component between the bonding chuck and the substrate. This plate can be transformed (deformed) during the bonding process to accommodate substrate deformation, thereby preventing permanent damage to the substrate itself while still enabling successful bonding. The transformation plate acts as a buffer that absorbs the mechanical stress and transformation that would otherwise be directly applied to the substrate.
2Manufacturing precision
If pressure is applied to bond substrates, then bonding is achieved, but misalignment of bonding pads occurs affecting packaging density
Solution Approach 1:
The transformation plate is designed to be dynamically transformable during the bonding process. It can change its shape and position in response to applied pressure and substrate deformation, maintaining optimal contact and alignment between bonding pads throughout the bonding process. This dynamic adaptation ensures precise alignment is maintained even under pressure, preventing misalignment issues that would reduce packaging density.
3Reliability
If substrate transformation is suppressed, then reliability is improved, but bonding process complexity increases
Solution Approach 1:
The transformation plate's key property is its ability to change physical parameters (shape, position, thickness) during the bonding process. By controlling these parameter changes, the system can suppress permanent substrate transformation while managing the complexity through controlled, predictable transformations of the plate itself. The plate's transformability is a designed parameter that allows it to adapt to bonding conditions without requiring complex real-time adjustments to the entire bonding apparatus.
Data Source
AI summary
A substrate bonding apparatus may include a first bonding chuck including a first base and a first transformation plate, and a second including a second base facing the first bonding chuck. The first base may include a recess groove. The recess groove may be recessed inward from a surface on which the first transformation plate is mounted. The first transformation plate may include a first protrusion protruding outward from a first surface of the first transformation plate. A second surface of the first transformation plate may be opposite the first surface of the first transformation plate. The second surface of the first transformation plate may be configured to support a first substrate. The first transformation plate may be mounted on the first base in a manner allowing a distance between the first transformation plate and the first base to vary.