Substrate Bonding Chuck Pressure Control for Low-Distortion Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate bonding techniques, such as direct or fusion bonding, often result in scale distortions due to inaccuracies in controlling the deflection and pressure between substrates during the bonding process.
Innovation Solution
A bonding device comprising chucks with independently controlled gas pressure regulators and a control unit that adjusts pressure based on substrate properties to precisely control deflection and incident angle, ensuring accurate alignment and minimizing distortions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If gas pressure is applied to deflect substrates during bonding, then bonding quality is improved, but scale distortions occur due to inaccurate pressure control
Solution Approach 1:
The system divides the pressure control into independent segments by providing separate gas pressure regulators (first gas pressure regulator and second gas pressure regulator) for each substrate, allowing individualized pressure adjustment to prevent scale distortions while maintaining bonding quality
Solution Approach 2:
The system changes the pressure parameters dynamically by independently adjusting the gas pressure applied to each substrate based on their specific properties (size, stiffness, temperature), enabling precise control of deflection to avoid distortions while achieving high bonding quality
2Manufacturing precision
If independent pressure control is implemented for each substrate, then scale distortions are reduced, but device complexity increases
Solution Approach 1:
The control unit serves multiple functions by simultaneously managing both gas pressure regulators, coordinating substrate positioning, and monitoring bonding parameters, thereby reducing overall system complexity despite independent pressure control
Solution Approach 2:
The system merges the control functions by integrating both pressure regulators under a single control unit that coordinates their operation based on substrate properties, simplifying the control architecture while maintaining precise independent pressure control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces scale distortions and enhances the quality of the bond by allowing for precise control of gas pressures and deflection angles between substrates, leading to more accurate and stable bonding.
Implementation Method 1
supplying gas with a first gas pressure to the first pressure port and supplying gas with a second gas pressure to the second pressure port so that the substrates are deflected towards each other
Data Source
AI summary
A bonding device has two chucks, two gas pressure regulators and a control unit. The chucks each have a holding surface with pressure ports fluidically connected to the respective gas pressure regulator. The control unit is electrically and/or wirelessly connected to the gas pressure regulators and configured to control gas pressure regulators independently from each other. Support elements movably mounted within the pressure ports, are provided to measure the amount of substrate deflection and adjust the respective gas pressures and also to apply additional mechanical pressure to the substrates. The two chucks may be mounted on corresponding support structures so as to be thermally isolated therefrom. The temperature of the two chucks may be equalised by moving the chucks into contact. A chuck tempering device may be used for equalising the temperature of the two chucks. The bonding device is used for bonding two substrates by bonding wave propagation.