Bonding Circuit Board Segmentation for Display Modules
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Solution Overview
Problem
The existing FMLOC touch display modules face challenges with low utilization rates and high material and manufacturing costs due to the need for irregularly shaped peripheral circuit boards, which are cut from multi-layered structures, leading to waste and increased expenses.
Innovation Solution
A bonding circuit board is designed with a first sub-section of stacked multiple printed circuit layers for regular shapes and a second sub-section of stacked single or double printed circuit layers for irregular shapes, allowing for flexible configuration and reduced waste, while maintaining structural integrity and insulation protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If irregularly shaped peripheral circuit boards are used to accommodate various display module shapes, then adaptability is improved, but material utilization rate deteriorates and manufacturing cost increases
Solution Approach 1:
The circuit board is divided into a first sub-section with regular shape and a second sub-section with irregular shape. The first sub-section uses multiple stacked printed circuit layers (at least three layers) while the second sub-section uses one or two printed circuit layers. This segmentation allows the regular-shaped first sub-section to maintain high material utilization rate while the irregular-shaped second sub-section provides adaptability to various display module shapes.
Solution Approach 2:
Different parts of the circuit board have different structural characteristics. The first sub-section has a regular shape with multiple stacked printed circuit layers for high material utilization, while the second sub-section has an irregular shape with fewer printed circuit layers for adaptability. This local differentiation resolves the contradiction between overall adaptability and material utilization.
2Adaptability or versatility
If irregularly shaped peripheral circuit boards are cut from multi-layered structures, then adaptability is improved, but manufacturing cost increases
Solution Approach 1:
The circuit board is segmented into first and second sub-sections with different structural complexities. The first sub-section maintains a regular shape suitable for standard manufacturing processes, while the second sub-section has an irregular shape. This segmentation reduces manufacturing complexity and cost compared to creating entirely irregular multi-layered boards.
Solution Approach 2:
The irregular shape and adaptability are localized to the second sub-section, while the first sub-section maintains regular geometry optimized for cost-effective manufacturing. This localized approach to irregularity reduces overall manufacturing complexity and cost.
3Strength
If multiple printed circuit layers are stacked to maintain structural integrity for irregular shapes, then structural integrity is improved, but material utilization rate deteriorates
Solution Approach 1:
The circuit board is divided into first and second sub-sections with different layer configurations. The first sub-section uses at least three stacked printed circuit layers to ensure structural integrity, while the second sub-section uses one or two layers. This segmentation maintains structural strength where needed while improving material utilization in the irregular-shaped portion.
Solution Approach 2:
Different regions of the circuit board have different numbers of printed circuit layers based on structural requirements. The first sub-section has multiple layers for high structural integrity, while the second sub-section has fewer layers for improved material utilization. This local differentiation resolves the contradiction between structural strength and material efficiency.
Data Source
AI summary
Embodiments of the present disclosure provide a bonding circuit board, one end of which is connected to a display panel, and the other end of which is connected to a host side; the bonding circuit board includes a first sub-section and a second sub-section, which may be bonded and connected to each other, the first sub-section includes at least three first printed circuit layers, which are stacked on one another, and an insulation layer is arranged between any two adjacent first printed circuit layers of the at least three first printed circuit layers; and the second sub-section includes one second printed circuit layer or two second printed circuit layers which are stacked on each other, and the insulation layer is arranged between the two second printed circuit layers.