Bonding Apparatus Optical Calibration for Collet Alignment
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Solution Overview
Problem
The existing bonding apparatus requires tedious manual adjustments and repeated trial and error to ensure accurate alignment of the bond head collet with the flip head collet, leading to potential picking errors, poor bonding quality, and increased setup time.
Innovation Solution
A bonding apparatus with a movable bond head collet, a reference marker that moves with the bond head, and imaging devices to optically calibrate the alignment of the bond head collet with the flip head collet, reducing manual effort and increasing precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual adjustment of bond head position is used, then alignment between bond head collet and flip head collet can be achieved, but setup time is prolonged and adjustment accuracy is reduced
Solution Approach 1:
The patent replaces the manual mechanical adjustment system with an optical imaging and calculation system. The imaging device captures images of the bond head collet and flip head collet, and a processor automatically calculates the offset and determines the handover position, eliminating the need for manual visual estimation and mechanical adjustment.
Solution Approach 2:
The system performs self-calibration by automatically capturing images, calculating offsets, and determining the handover position without requiring operator intervention. The bonding apparatus adjusts its own parameters based on the optical measurement data, making the system self-sufficient in the alignment process.
2Reliability
If repeated trial and error adjustment is performed, then satisfactory alignment can be achieved, but picking errors may occur and bonding quality deteriorates
Solution Approach 1:
The patent replaces iterative mechanical trial-and-error adjustment with a single-step optical measurement and calculation process. The imaging device and processor directly determine the precise handover position in one operation, eliminating repeated adjustments and reducing the risk of picking errors that occur during iterative mechanical tuning.
3Manufacturing precision
If manual visual estimation is used for offset determination, then alignment can be achieved, but accuracy is insufficient for small die packages
Solution Approach 1:
The patent replaces manual visual estimation with an optical imaging system that captures precise images of the collets. The processor automatically calculates the offset between the bond head collet and flip head collet centers, providing high-precision handover position determination suitable for small die packages without requiring complex manual measurement tools.
Solution Approach 2:
The imaging device serves as an intermediary between the physical collets and the control system. It captures optical information about the collet positions and transfers this data to the processor, which then calculates the precise handover position, acting as a mediator that bridges the physical and digital domains with high accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optical calibration method significantly reduces setup time and improves alignment accuracy, ensuring secure handling of small die packages and minimizing picking errors, thus enhancing bonding quality and throughput.
Implementation Method 1
a first imaging device configured to capture one or more images of the reference marker and the flip head collet; a second imaging device configured to capture one or more images of the reference marker and the bond head collet
Data Source
AI summary
A bonding apparatus comprises a movable bond head collet, a reference marker configured to move with the bond head collet, a flip head collet, first and second imaging devices and an adjusting mechanism. In use, the first imaging device captures one or more images of the reference marker and the flip head collet, and the second imaging device captures one or more images of the reference marker and the bond head collet. The adjusting mechanism aligns a position of the bond head collet with a position of the flip head collet based on an offset that is determined from the images of the flip head collet, bond head collet and reference marker. The flip head collet retrieves an electrical component and transfers the electrical component to the bond head collet at the alignment position.