Tin-Germanium-Nickel Bonding Composition for Oxide-Safe Hermetic Sealing
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Solution Overview
Problem
Conventional bonding compositions face challenges in bonding materials with oxides, particularly at high temperatures, as they often require the removal of oxide layers using ultrasonic waves, which is difficult under vacuum conditions and can lead to voids and reduced hermetic sealing properties.
Innovation Solution
A composition comprising tin, germanium, nickel, and optionally iridium, with specific mass percentage ratios and oxygen content, that prevents the formation of oxide layers during application, ensuring strong bonding and hermetic sealing without the need for oxide layer removal, even under vacuum conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding compositions are used to bond materials with oxides, then bonding can be achieved, but oxide layers form on the composition surface during melting requiring ultrasonic removal
Solution Approach 1:
The invention converts the harmful oxide formation into a beneficial feature by formulating the bonding composition with specific metal components (Al, Ti, Zn, Ir) and oxygen content that intentionally form protective oxide layers during melting. These oxide layers prevent further oxidation and improve wetting with oxide-containing substrates, eliminating the need for ultrasonic removal while enhancing bonding reliability
Solution Approach 2:
The invention changes the chemical composition parameters of the bonding material by specifying precise ranges of metal components (Al: 0.1-6.0%, Ti: 0.01-1.0%, Zn: 0.1-5.0%, Ir: 0.003-0.1%) and oxygen content (0.003-2.0%), which fundamentally alters the oxidation behavior during melting to prevent harmful oxide layer formation on the surface
2Manufacturing precision
If ultrasonic waves are used to remove oxide layers, then bonding quality improves, but hermetic sealing properties deteriorate due to void formation
Solution Approach 1:
The invention performs preliminary action by formulating the bonding composition with specific metal components and oxygen content that prevent harmful oxide layer formation on the surface during melting. This preliminary prevention eliminates the need for subsequent ultrasonic removal, thereby maintaining hermetic sealing properties while ensuring bonding quality
3Temperature
If brazing materials with low melting temperature are used, then bonding temperature is reduced, but adhesion to glass and oxide materials is insufficient
Solution Approach 1:
The invention creates a composite bonding material combining multiple metal components (Sn, Al, Ti, Zn, Ir) with specific oxide content, where each component contributes different properties: Sn provides low melting temperature, Al/Ti/Zn enhance adhesion to oxide and glass surfaces, and Ir improves oxidation resistance. This composite formulation achieves both low bonding temperature and strong adhesion simultaneously
Solution Approach 2:
The invention applies local quality by having different components serve different functions within the bonding composition: Al, Ti, and Zn specifically target oxide and glass surfaces to enhance adhesion, while Sn maintains low melting temperature, and Ir provides overall oxidation resistance. This functional differentiation allows the material to achieve multiple objectives simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent bonding strength and hermetic sealing by controlling oxide formation and thermal expansion differences, enhancing handling properties and maintaining sealing integrity under various environmental conditions.
Implementation Method 1
when the composition for bonding is molten in order to be applied on a bonding surface of each material to be bonded, an oxide layer is easily generated on a surface of the composition for bonding
Implementation Method 2
a composition for bonding that can be used for bonding even in the case where the bonding portion of the material to be bonded includes an oxide
Data Source
Figure 1
Figure 2(A)~2(C')
Figure 3(A)~3(B)
AI summary
A composition for bonding includes tin, germanium, and nickel. A contained amount of germanium is less than or equal to 10 mass%. The contained amount of germanium and a contained amount of nickel satisfy a relation (1) Ni≤2.8×Ge0.3, where [Ni] is the contained amount of nickel in mass% and [Ge] is the contained amount of germanium in mass%.