Temporary Bonding Composition for Fast Cure and Laser Release
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Solution Overview
Problem
Conventional adhesive compositions for temporary bonding in electronic device manufacturing are inadequate in curing rate, suitability for spin coating processes, heat resistance, low outgas properties under high temperature vacuum, and release rate, particularly in UV laser release processes.
Innovation Solution
A composition comprising monofunctional (meth)acrylate with a side chain of 18 or more carbon atoms and a glass transition temperature of −100° C. to 60° C., polyfunctional (meth)acrylate, polyisobutene homopolymer or copolymer, and a photo radical polymerization initiator, optionally with an UV absorber, which can be cured with light of 350 to 700 nm and released with a laser of less than 385 nm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional adhesive compositions are used for temporary bonding, then bonding strength is achieved, but curing rate is insufficient
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by incorporating specific photopolymerizable compounds (acrylates, vinyl ethers, epoxides) and catalysts, enabling the adhesive to cure rapidly under UV or visible light irradiation while maintaining bonding strength through controlled polymerization reactions
Solution Approach 2:
The patent replaces conventional thermal curing or mechanical bonding methods with photochemical curing using UV or visible light irradiation, achieving rapid curing without heat treatment and enabling high-speed production processes
2Ease of manufacture
If conventional adhesive compositions are used, then bonding is achieved, but suitability for spin coating processes is poor
Solution Approach 1:
The patent adjusts the viscosity and compositional parameters of the adhesive formulation to optimize spin-coating performance, achieving uniform thin films through controlled rheological properties that enable proper spreading and leveling during the spin-coating process
3Temperature
If conventional adhesive compositions are used, then bonding strength is achieved, but heat resistance is insufficient
Solution Approach 1:
The patent creates a composite adhesive system combining photopolymerizable compounds, catalysts, and heat-resistant additives that maintain bonding strength at elevated temperatures while enabling UV or visible light curing, achieving both thermal stability and adhesive performance
Solution Approach 2:
The patent modifies the chemical structure and composition parameters of the adhesive to enhance thermal stability, incorporating components with high glass transition temperatures and thermal decomposition resistance while maintaining cureability under UV or visible light
4Object-affected harmful factors
If conventional adhesive compositions are used, then bonding is achieved, but outgas properties under high temperature vacuum are poor
Solution Approach 1:
The patent selects and formulates adhesive components with low vapor pressure and minimal outgassing characteristics, adjusting the compositional parameters to exclude volatile substances that would outgas under vacuum conditions while maintaining bonding reliability
Solution Approach 2:
The patent designs the adhesive composition to be chemically inert under vacuum conditions, selecting components that do not decompose or outgas in high-temperature vacuum environments, ensuring stable bonding performance in semiconductor manufacturing vacuum processes
5Productivity
If conventional adhesive compositions are used, then bonding is achieved, but release rate in UV laser release processes is insufficient
Solution Approach 1:
The patent designs the adhesive with specific photopolymer structure parameters that enable selective degradation under UV laser irradiation, incorporating photo-labile groups or weak bonds that break upon UV exposure to facilitate rapid release while maintaining strong initial bonding
Solution Approach 2:
The patent implements a two-stage process where the adhesive first provides strong bonding, then undergoes controlled decomposition under UV laser irradiation to enable release, using periodic or pulsed UV treatment to achieve complete release without damaging the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition exhibits excellent curing rate, suitability for spin coating, heat resistance, low outgas properties under high temperature vacuum, and efficient release through mechanical or laser processes, eliminating the need for high-energy excimer light.
Implementation Method 1
a photo radical polymerization initiator, optionally with an UV absorber, which can be cured with light of 350 to 700 nm
Implementation Method 2
an UV absorber, which can be cured with light of 350 to 700 nm and released with a laser of less than 385 nm
Data Source
AI summary
A composition for temporary bonding, includes: (A) a (meth)acrylate having the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose side chain is an alkyl group having 18 or more carbon atoms and homopolymer has a Tg of −100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer and/or a polyisobutene copolymer; and (C) a photo radical polymerization initiator.