Bonding Device Squeeze Sub-Portion Step Differences
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manual process of bonding adhesive layers in display module manufacturing, particularly at locations with step differences, is inefficient and costly, leading to reduced production efficiency and increased labor costs.
Innovation Solution
A bonding device with a lamination part that includes a squeeze sub-portion with a smaller width than the lamination main portion, allowing for mechanized bonding of adhesive layers with improved efficiency and reduced labor costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual squeezing and bonding by hand is used, then bonding can be achieved, but efficiency is low and labor costs are high
Solution Approach 1:
The patent replaces manual mechanical squeezing with an automated lamination device that uses a lamination part to press and bond the adhesive layer. The device substitutes human hand operations with a mechanical lamination system that can be integrated into automated production lines, thereby improving bonding efficiency and reducing labor costs while maintaining bonding quality.
2Ease of manufacture
If manual bonding is used, then bonding can be performed, but labor costs increase
Solution Approach 1:
The lamination part is designed to perform the bonding function autonomously without requiring manual intervention. The device applies adhesive and presses the layers together automatically, allowing the manufacturing process to be self-sufficient and independent of skilled labor, thereby reducing labor costs while maintaining ease of manufacture through automated operation.
3Ease of manufacture
If a lamination part with uniform width is used, then manufacturing is simple, but bonding at step difference locations is ineffective
Solution Approach 1:
The lamination part features a squeeze sub-portion with a smaller width than the main portion, creating a localized narrower section that can precisely reach into step difference locations. This local quality variation allows the device to effectively bond adhesive at step differences while maintaining overall manufacturing simplicity through a straightforward extrusion or molding process that accommodates the width variation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bonding device facilitates mechanized bonding, enhances bonding efficiency, reduces labor costs, and ensures effective bonding without compromising the quality of the adhesive layer application.
Implementation Method 1
the flexible body comprises a first portion and a second portion disposed oppositely... an elastic modulus of the first portion is different from an elastic modulus of the second portion
Data Source
AI summary
The embodiment of the present invention discloses a bonding device. The bonding device includes a main body and a lamination part connected to the main body. The lamination part is configured to press and bond an adhesive layer to an apparatus to be bonded, and includes a lamination main portion and a squeeze sub-portion connected to the lamination main portion. Along a lamination direction perpendicular to the lamination part, a width of the squeeze sub-portion is less than a width of the lamination main portion. The present invention, by using the squeeze sub-portion of the lamination part with a smaller width, more conveniently squeezes and bonds the adhesive layer, which facilitates mechanized bonding, improves a bonding efficiency, and reduces a labor cost while guaranteeing a bonding effect.