Bonding Device Vacuum Channel Design for Laser Heating Efficiency
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Solution Overview
Problem
Conventional bonding devices experience a decrease in heating efficiency due to flux or bonding materials adhering to the inner surfaces of the housing and transmitting members, blocking the laser beam and requiring frequent maintenance.
Innovation Solution
A bonding device with a light guiding system that uses multiple laser beams with different paths and a tool base configuration, including a laminated structure with a small attraction passage between the laser beams, to minimize flux adherence and maintainability issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional bonding head with a through-hole attraction passage is used, then the electronic component can be attracted and held on the bonding tool, but the transpired flux adheres to the inner surface of the housing and transmitting members, blocking the laser beam and deteriorating heating efficiency
Solution Approach 1:
The bonding head is divided into functionally independent parts: the attraction passage is separated from the main housing interior by positioning it within the tool base structure. This segmentation allows the attraction passage to be isolated from the housing inner surface, preventing flux from adhering to the housing while maintaining the attraction function. The transmitting members are also structurally separated from the attraction passage route.
Solution Approach 2:
The attraction passage function is extracted from the housing structure and integrated into the tool base. By forming the attraction passage within the tool base itself rather than through the housing, the harmful flux adherence is removed from the laser beam path. The attraction passage is taken out of the housing interior and repositioned in a location that does not interfere with laser transmission.
2Reliability
If the attraction passage is enlarged to improve component attraction, then the bonding reliability improves, but the area exposed to flux increases, leading to greater laser beam blockage
Solution Approach 1:
The attraction passage is designed with locally optimized dimensions that are sufficient for component attraction but minimized to reduce flux exposure. The passage cross-sectional area and length are precisely controlled to provide only the necessary attraction function without excess surface area that would expose flux to the housing interior. This local quality optimization ensures adequate attraction while minimizing laser beam blockage.
3Ease of operation
If the housing interior surface area is increased to accommodate the attraction passage, then the attraction function is maintained, but the flux adherence area increases, requiring more frequent maintenance
Solution Approach 1:
The attraction passage is extracted from the housing interior and repositioned within the tool base structure. This extraction removes the attraction passage surface from the housing interior, eliminating the need to clean the housing inner surface for flux removal. The attraction function is maintained in its new location while the housing interior remains clean and maintenance-free.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents deterioration of heating efficiency by containing flux within a small area and allows for easier cleaning and maintenance, while maintaining effective bonding of semiconductor chips to substrates.
Implementation Method 1
a laser resonator configured to oscillate a laser beam
Implementation Method 2
light guiding means for guiding the laser beam oscillated from the laser resonator to the bonding head
Implementation Method 3
when a tool attraction passage formed in a housing of the bonding head communicates with an attraction device, the housing is attracted by an attraction device
Implementation Method 4
heating the electronic component with the laser beam transmitted through the tool base
Implementation Method 5
a condensing lens in the housing
Data Source
AI summary
A chip attraction passage 23 is provided extending through a housing 5A, a tool base 13, and a bonding tool 14. When the chip attraction passage 23 is attracted by the vacuum source 32, a semiconductor chip 3 can be attracted to and held on the lower surface of the bonding tool 14. The tool base 13 is configured by laminating transmitting members 11 and 12. A connection passage 29, which is a main part of the chip attraction passage 23, is configured by a groove 12B formed on the upper surface of the transmitting member 12 and a through-hole 12A in the center of the transmitting member 12. When the semiconductor chip 3 is heated by laser beams L and bonded to a substrate 2, even if flux or the like adhering to bumps 35 transpires and adheres in the connection passage 29.