Bonding Electrode Mask Layout for Kerf Region Overlap

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Solution Overview

Problem

Existing methods for manufacturing semiconductor devices using bonded wafers face challenges in achieving precise alignment and overlap of bonding electrodes in kerf regions, leading to potential voids and bonding failures.

Innovation Solution

A designing method for a mask set used in lithographic exposure to pattern bonding electrodes in wafers, involving the specification of bonding electrode sizes and shapes, placement of bonding electrode patterns in kerf regions, identification of unplaceable regions, and removal of non-overlapping bonding electrode patterns to ensure overlap and improve bonding efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If bonding electrode patterns are placed in kerf regions without considering unplaceable regions, then the number of bonding electrodes increases, but alignment precision and bonding reliability deteriorate due to voids and misalignment

Engineering Contradiction:

Improvenumber of bonding electrodesVSAvoidalignment precision of bonding electrodes

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

The method performs preliminary identification of unplaceable regions in the kerf area before final pattern placement. By pre-defining regions where bonding electrodes cannot be placed (due to lithography mark interference, dicing saw paths, or other constraints), the system ensures that subsequent electrode placement avoids these problematic areas, thereby guaranteeing alignment precision while maximizing electrode quantity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The kerf region is divided into placeable and unplaceable sub-regions based on local constraints. Different quality requirements are applied to different areas: unplaceable regions exclude lithography marks and dicing paths to ensure alignment precision, while placeable regions allow bonding electrode placement to maximize quantity. This local differentiation resolves the contradiction between数量 and precision.

Inventive Principle:

Principle #3Local quality

2Reliability

If bonding electrode patterns are placed to maximize overlap, then bonding reliability improves, but manufacturing complexity increases due to iterative removal and verification processes

Engineering Contradiction:

Improvebonding reliabilityVSAvoidmask design complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The method performs preliminary placement of bonding electrode patterns in the kerf region before iterative removal. By initially placing patterns to maximize overlap and bonding reliability, then systematically removing patterns in unplaceable regions and non-overlapping sections, the system maintains high bonding reliability while managing design complexity through a structured multi-step process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The bonding electrode pattern design is segmented into multiple processing stages: initial placement, removal in unplaceable regions, removal in non-overlapping sections, and verification. This segmentation of the design process into discrete, manageable steps reduces overall complexity while ensuring bonding reliability is achieved through systematic optimization.

Inventive Principle:

Principle #1Segmentation

3Productivity

If iterative removal of non-overlapping patterns is performed, then bonding efficiency improves, but processing time increases

Engineering Contradiction:

Improvebonding efficiencyVSAvoidmask design processing time

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The method performs preliminary identification of unplaceable regions and preliminary placement of bonding electrode patterns before iterative removal. By pre-defining constraints and initial configurations, the system reduces the number of iterative cycles needed, thereby improving bonding efficiency while minimizing the time loss associated with iterative processing.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The method extracts and removes only the necessary portions of bonding electrode patterns that fall in unplaceable regions or non-overlapping sections. By selectively removing only the problematic patterns rather than reprocessing all patterns iteratively, the system improves bonding efficiency while reducing total processing time through targeted extraction and removal.

Inventive Principle:

Principle #2Taking out (Extraction)

Data Source

PatentUS20250038140A1Designing method, semiconductor device, and mask set

Publication Date: 2025.01.30 KIOXIA CORP

AI summary

The designing method includes: arranging a plurality of bonding electrode patterns in the kerf regions of the first and second mask; each unplaceable region is identified in each of kerf regions of the first and second mask; removing the bonding electrode patterns placed in the unplaceable region; generating a first pattern group and a second pattern group formed in the kerf regions when the first mask and the second mask are used to perform lithographic exposure while changing a position; and removing the bonding electrode patterns placed in a non-overlapping section in each of the kerf regions of the first mask and the second mask, the non-overlapping section being a plurality of positions of a plurality of the bonding electrode patterns included in the first pattern group and in the second pattern group do not overlap when the first wafer and the second wafer are bonded.