Bonding Device for Flexible Substrates with Movable Supports
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Solution Overview
Problem
Existing bonding devices require different designs for flexible substrates with varying bending angles, leading to increased costs and inefficiencies, as they need to accommodate both small-angle and large-angle bending forms, necessitating multiple supports for substrates of different sizes and shapes.
Innovation Solution
A bonding device with a supporting assembly and stretching assembly, where the supporting assembly includes movable supporting bodies and a carrier film with driving elements to align and support flexible substrates of different curvature degrees, allowing for efficient bonding with a single device configuration that adapts to both small-angle and large-angle bending substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If different bonding devices are designed for flexible substrates with different bending angles, then bonding precision is improved, but device complexity and cost increase
Solution Approach 1:
The bonding device employs a supporting assembly with movable supporting bodies that can be adjusted to accommodate flexible substrates with different bending angles (small-angle and large-angle bending). This universal design allows a single device to perform multiple bonding functions rather than requiring separate dedicated devices for each bending angle, thereby reducing device complexity and cost while maintaining bonding precision through proper adaptation to different substrate configurations
2Adaptability or versatility
If multiple supporting bodies are used for substrates of different sizes and shapes, then adaptability is improved, but device complexity increases
Solution Approach 1:
The supporting assembly incorporates movable supporting bodies that can dynamically adjust their positions and configurations. This dynamic capability enables the device to adapt to flexible substrates of different sizes and shapes (including different bending angles) without requiring multiple fixed supporting structures, thereby achieving high adaptability while minimizing device complexity through a single reconfigurable system
Data Source
AI summary
A bonding device includes: a supporting assembly, comprising a first and second supporting bodies arranged in a first direction, at least one of the first and second supporting bodies is movable in the first direction, the supporting assembly having an upper surface which faces a flexible substrate and matches an inner surface of the flexible substrate; and a stretching assembly, including a carrier film and a plurality of driving elements, a central area of the carrier film being attached to the inner surface of the flexible substrate, at least two of the plurality of driving elements arranged oppositely in the first direction, at least two of the plurality of driving elements arranged oppositely in a second direction, the plurality of driving elements are connected to peripheral portions of the carrier film, and stretches the peripheral portions of the carrier film to align the inner surface with the supporting assembly.