Bonding Head Pressure Control for Adhesive-Free Chip Stacking
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Solution Overview
Problem
Existing semiconductor manufacturing methods face challenges in directly bonding semiconductor chips without adhesives, requiring precise alignment and pressure control to ensure reliable bonding without voids or defects.
Innovation Solution
A semiconductor manufacturing apparatus with a bonding head featuring an attachment pad that uses vacuum channels and adjustable air pressure to deform and align semiconductor chips, enabling direct chip-to-substrate bonding without adhesives, and includes tilting and rotation mechanisms for precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive medium is used for chip stacking, then bonding reliability is improved, but manufacturing complexity and environmental concerns increase
Solution Approach 1:
The patent removes the adhesive medium from the bonding process entirely, achieving direct bonding between chip and substrate through vacuum attachment and controlled pressure application. This extraction of the adhesive component simplifies the manufacturing process while maintaining bonding reliability through direct mechanical and thermal bonding.
Solution Approach 2:
The bonding head serves as an intermediary device that facilitates direct bonding by providing vacuum attachment to hold the chip, applying controlled pressure during bonding, and enabling precise positioning. This intermediary mechanism replaces the need for adhesive while ensuring reliable chip-substrate bonding.
2Ease of manufacture
If direct bonding method is used without adhesive, then manufacturing simplicity is improved, but alignment precision and pressure control difficulty increase
Solution Approach 1:
The patent replaces complex mechanical alignment systems with a vacuum-based attachment mechanism. The vacuum channels in the bonding head create secure attachment to the chip, allowing precise positioning and alignment through the vacuum force itself, which naturally centers and holds the chip in place during the bonding process.
Solution Approach 2:
The bonding head incorporates adjustable pressure control to optimize bonding conditions. By controlling the vacuum pressure and bonding pressure parameters, the system achieves precise alignment and reliable bonding without requiring complex mechanical alignment mechanisms, simplifying the overall manufacturing process.
3Reliability
If vacuum pressure is applied for chip attachment, then chip holding reliability is improved, but chip deformation risk increases
Solution Approach 1:
The bonding head features vacuum channels positioned at specific locations to apply vacuum pressure locally at the edges or corners of the chip rather than uniformly across the entire chip surface. This localized vacuum application secures the chip firmly while minimizing stress and deformation on the chip structure.
Solution Approach 2:
The system applies vacuum pressure selectively to hold the chip during attachment and positioning, then releases or reduces the vacuum pressure before the bonding process to prevent deformation. This partial application and removal of vacuum force ensures secure handling while protecting chip integrity.
4Manufacturing precision
If bonding head adjusts pressure for alignment, then bonding precision is improved, but device complexity increases
Solution Approach 1:
The bonding head is designed as a multi-functional device that combines vacuum attachment, pressure control for alignment, and bonding functions in a single integrated component. The same bonding head structure performs multiple functions: attaching the chip via vacuum, applying pressure for alignment, and facilitating the bonding process, thereby reducing overall device complexity while maintaining high bonding precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable, void-free bonding between semiconductor chips and substrates, improving bonding reliability and density while eliminating the need for adhesives, thus enhancing manufacturing efficiency and product quality.
Implementation Method 1
a vacuum channel extending from the bottom surface
Implementation Method 2
an air pressure adjuster configured to inject or exhaust air into or from the cavity of the attachment pad, such that the pressure of air in the cavity of the attachment pad is adjusted
Data Source
AI summary
A semiconductor manufacturing apparatus configured to bond a substrate to a semiconductor chip includes a support configured to mount a substrate on a main surface of the support; and a bonding head configured to transfer the semiconductor chip to stack the semiconductor chip on the substrate and including an attachment pad configured to attach the semiconductor chip, wherein the attachment pad includes a bottom surface configured to attach the semiconductor chip; a vacuum channel extending from the bottom surface; and a cavity, and wherein the bonding head is configured to adjust a shape of the bottom surface of the attachment pad by adjusting a pressure of air in the cavity.