Bonding Head Contact Detection for Flip Chip Mounting

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Solution Overview

Problem

In flip chip mounting, accurately determining the mounting position on a circuit board is challenging due to factors like tool wear, bolt loosening, and motor hysteresis, leading to potential defects and reduced productivity.

Innovation Solution

A device mounting method and apparatus that utilize a bonding head with a controller to determine the search height and bonding height, employing conditions such as height differences, velocity comparisons, and predetermined ranges to accurately determine contact with the board, ensuring precise mounting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the spindle repeatedly moves up and down to pick-up, dip, inspect, and mount parts, then productivity is improved, but tool wear and positioning accuracy deteriorate

Engineering Contradiction:

Improvemounting speedVSAvoidmounting position accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The system continuously monitors the actual height of the bonding head using sensors and compares it with the command height. This feedback mechanism detects deviations caused by tool wear or positioning errors and adjusts the positioning accordingly, maintaining mounting accuracy despite repeated operations

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent replaces purely mechanical positioning with a hybrid system that uses sensors (optical or capacitive) to detect the actual position of the bonding head. This substitution of mechanical sensing with electronic sensing allows for more precise and wear-resistant positioning

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If the bonding head is lowered quickly to increase productivity, then mounting speed is improved, but positioning accuracy and vibration control worsen

Engineering Contradiction:

Improvemounting speedVSAvoidpositioning accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The bonding head movement is divided into periodic phases: rapid descent to the board surface, then a slower approach phase when near the mounting position. This periodic variation in speed allows both fast productivity and accurate positioning

Inventive Principle:

Principle #19Periodic action

Solution Approach 2:

The system dynamically adjusts the lowering speed of the bonding head based on real-time feedback. When the bonding head is far from the board, it moves quickly; when approaching the mounting position, the speed is reduced to ensure accuracy and minimize vibrations

Inventive Principle:

Principle #15Dynamics

3Adaptability or versatility

If the bonding head is lowered to search for mounting position, then adaptability is improved, but time consumption and productivity worsen

Engineering Contradiction:

Improvemounting position detectionVSAvoidsearch time

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent introduces an intermediary sensor system that detects the mounting position without requiring the bonding head to physically search through multiple positions. The sensor provides intermediate information about the board surface, enabling direct positioning

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS8677614B2Device mounting method determining touching between device and board

Publication Date: 2014.03.25 HANWHA PRECISION MACHINERY CO LTD

AI summary

Provided are a chip mounting method and device. The chip mounting device comprises: a bonding head on which a device is loaded; and a controller which places the bonding head at a preparation height above a board, determines a search height at which a mounting position on the board, on which the device is to be mounted, is searched for by the controller, and lowers the bonding head from the preparation height to a bonding height via the search height and mounts the device on the mounting position on the board, by controlling movements of the bonding head, wherein the controller determines that the device touches the board if at least one of a plurality of conditions is satisfied.