Bonding Head Cooling Channel Design for Die Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing bonding heads in die bonding processes contaminate the process chamber with particles generated by air cooling and prolong the cooling time for the heater and bonding tool, reducing productivity.
Innovation Solution
A bonding head with a plate heater and collet using vacuum pressure, featuring integrated cooling channels and passages to supply and recover a cooling fluid, such as dry air, directly at the lower surface, allowing for efficient cooling of the plate heater while minimizing contamination and reducing cooling time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air is used as cooling fluid and discharged to the outside from cooling passages, then the heater base and bonding tool are cooled, but particles are generated that contaminate the process chamber
Solution Approach 1:
The invention extracts the harmful function of air discharge from the cooling system. Instead of discharging air into the process chamber, the cooling passages are designed to circulate cooling fluid in a closed loop, eliminating particle generation while maintaining cooling effectiveness
Solution Approach 2:
The invention creates an inert cooling environment by using a closed-loop cooling fluid system that does not interact with the process chamber atmosphere. The cooling fluid remains contained within the cooling passages, preventing contamination while transferring heat from the heater base and bonding tool
2Temperature
If air cooling is used for both heater base and bonding tool, then cooling is achieved, but the time required for cooling is increased
Solution Approach 1:
The invention employs hydraulic cooling by circulating liquid cooling fluid through the cooling passages. This liquid-based cooling system transfers heat more efficiently than air cooling, reducing the cooling time for both the heater base and bonding tool while maintaining effective temperature control
Solution Approach 2:
The closed-loop cooling system enables continuous circulation of cooling fluid through the cooling passages, maintaining constant cooling effectiveness without interruption. This continuous action ensures rapid and consistent cooling of the heater base and bonding tool, minimizing cycle time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively decreases contamination in the process chamber and shortens the temperature adjustment time for the bonding head, enhancing productivity by isolating the cooling process to the plate heater and improving cooling efficiency.
Implementation Method 1
a plate heater mounted to a lower surface of the body
Implementation Method 2
a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure
Implementation Method 3
cooling passages may be formed through the body and may be connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater
Data Source
AI summary
A bonding head and a die bonding apparatus having the same are disclosed. The bonding head includes a body connected to a driving section for transferring the die, a plate heater mounted to a lower surface of the body and a collet mounted to a lower surface of the plate heater and configured to hold the die using a vacuum pressure. A cooling channel is formed at the lower surface of the body, and cooling passages are formed through the body and connected with the cooling channel to supply a cooling fluid into the cooling channel and to recover the cooling fluid from the cooling channel thereby cooling the plate heater.