Bonding Head Copying Mechanism for Precise Surface Parallelism
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Solution Overview
Problem
Conventional semiconductor device manufacturing techniques face challenges in accurately adjusting the holding surface of a bonding head to be parallel to a substrate surface due to friction and other influences, leading to incomplete parallelism.
Innovation Solution
A semiconductor device manufacturing device and method utilizing a copying mechanism with a fixed and movable spherical surface pair, controlled by a controller to adjust the holding surface of the bonding head to be parallel to a reference plane by moving the bonding head relative to the reference plane while maintaining a free state until a predetermined position is reached, then switching to a locked state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the bonding head is simply pressed to the stage or first target object to adjust parallelism, then the adjustment procedure is simple, but the holding surface cannot be made completely parallel due to friction and other influences
Solution Approach 1:
The invention employs a spherical surface copying mechanism where a spherical surface on the bonding head contacts a corresponding spherical surface on the stage or first target object. This spherical geometry allows the bonding head to rotate and self-align, enabling the holding surface to precisely follow the reference surface curvature and achieve high-accuracy parallelism adjustment without being constrained by friction in traditional pressing methods
Solution Approach 2:
The invention implements a copying mechanism where the spherical surface configuration on the bonding head replicates the spherical surface geometry of the stage or first target object. By having the bonding head's spherical surface contact and follow the reference spherical surface, the holding surface automatically copies the reference surface's orientation and achieves precise parallelism through geometric replication rather than forced alignment
2Adaptability or versatility
If the copying mechanism is set to free state for adjustment, then the holding surface can follow the reference plane, but friction and other influences prevent complete parallelism
Solution Approach 1:
The spherical surface contact between the bonding head and stage creates a geometric constraint that guides the bonding head's orientation. The curved spherical interface allows smooth rotation and self-alignment while maintaining continuous contact, enabling the holding surface to accurately follow the reference plane's curvature and achieve precise parallelism without being hindered by frictional forces that would affect flat-surface contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-accuracy parallel adjustment of the holding surface to the substrate surface with a simple procedure, reducing residual parallelism errors and maintaining precise alignment.
Implementation Method 1
The copying mechanism has a fixed member including one of a concave spherical surface and a convex spherical surface and a movable member including the other of the concave spherical surface and the convex spherical surface. The movable member is capable of swinging three-dimensionally with respect to the fixed member.
Implementation Method 2
a bonding head, sucking and holding a chip by using a holding surface opposite to the stage
Data Source
AI summary
This semiconductor device manufacturing device comprises: a stage; a bonding head; a copying mechanism provided on the bonding head; and a controller that executes the copying process to adjust a facing surface to be parallel to a reference plane by having the facing surface, which is a holding surface or a chip end face, follow the reference plane 110, which is a planar surface of the stage or a substrate. In the copying process, the controller moves the bonding head relative to the surface direction of the reference plane with the facing surface left abutting the reference plane in a state with the copying mechanism switched to a free state, until the axial direction position of the bonding head reaches a stipulated reference position, and when the axial direction position reaches the reference position, switches the copying mechanism to a locked state.