Bonding Head and Die Transfer Seat Array for Precise High-Throughput Placement
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Solution Overview
Problem
Advanced packaging technologies face challenges in achieving high throughput while maintaining precise die placement, with single-die transfer techniques offering high precision but low throughput, and multi-die transfer techniques struggling with precise placement.
Innovation Solution
A system comprising a substrate chuck, an array of bonding heads, and an array of die transfer seats, where the die transfer seats are positioned along a carriage, allowing for high throughput and precise die placement by using a carriage with multiple die transfer seats and bonding heads, along with optical components for alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single-die transfer technique is used, then die placement precision is improved, but throughput deteriorates
Solution Approach 1:
The system segments the transfer function by using multiple die transfer seats (N seats) that can simultaneously hold and transfer multiple dies. Each seat operates independently to transfer dies to corresponding bonding heads, enabling parallel processing while maintaining precision through individual seat control mechanisms.
Solution Approach 2:
The system merges multiple die transfer seats and bonding heads into a single integrated apparatus. The N die transfer seats are positioned along the carriage, and M bonding heads are arranged in an array, allowing simultaneous transfer and bonding operations to occur in the same system, thereby increasing throughput without sacrificing precision.
2Productivity
If a multi-die transfer technique is used, then throughput is improved, but die placement precision deteriorates
Solution Approach 1:
The system employs a movable carriage that can dynamically position the N die transfer seats relative to the M bonding heads. The carriage enables precise positioning and alignment during the transfer process, maintaining placement precision while allowing multiple dies to be transferred simultaneously for high throughput.
Solution Approach 2:
The system incorporates an array of optical components that provide real-time feedback for alignment and positioning. These optical components monitor the positions of dies on the transfer seats and bonding heads, enabling closed-loop control to maintain precise placement even during multi-die simultaneous transfer operations.
3Productivity
If multiple bonding heads and die transfer seats are used, then throughput is improved, but device complexity increases
Solution Approach 1:
The die transfer seats serve multiple functions: they hold dies during transfer, position dies with precision, and coordinate with bonding heads for simultaneous operations. The carriage provides universal positioning capability for all N transfer seats and M bonding heads, reducing the need for separate control mechanisms and simplifying the overall device architecture.
Data Source
AI summary
A system can include a substrate chuck, an array of M bonding heads, an array of N*M die transfer seats, and a carriage. The substrate chuck and the array of N*M die transfer seats can be positioned along the carriage. Each of N and M can be greater than 1. A method of using the system can include transferring a first set of dies from the array of N*M die transfer seats to the array of M bonding heads, bonding the first set of dies to a destination substrate, transferring a second set of dies from the array of N*M die transfer seats to the array of M bonding heads, and bonding the second set of dies to the destination substrate. In an implementation, the same carriage including die transfer seats and a substrate chuck can help to reduce movement during an alignment or bonding operation.