Bonding Head Position Correction for Heat-Induced Die Drift
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Solution Overview
Problem
The existing die bonding process for semiconductor elements faces challenges in accurately bonding the die to the substrate due to positional deviations caused by high temperatures or radiant heat, which are not efficiently addressed by current correction methods.
Innovation Solution
A bonding apparatus with a bonding head equipped with a bonding nozzle and a position detection camera, which performs mark correction at regular intervals by imaging a reference mark and adjusting the bonding head's position based on detected positional deviations. Additionally, the apparatus performs actual position correction when the cumulative value of mark correction amounts exceeds a threshold, optimizing the timing of corrections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If actual position correction is performed for every bonding to eliminate positional deviation, then bonding precision is improved, but productivity deteriorates due to excessive time consumption
Solution Approach 1:
The system performs mark correction at every prescribed timing (partial action) to maintain positioning accuracy, while performing actual position correction only when the cumulative correction amount exceeds a threshold (avoiding excessive action). This selective application of correction operations resolves the contradiction by applying corrections only when necessary, thereby maintaining bonding precision without sacrificing productivity.
Solution Approach 2:
The system continuously monitors the cumulative correction amount through mark correction and triggers actual position correction based on feedback from this monitoring. The control unit compares the cumulative correction amount against a threshold and activates actual position correction only when needed, creating a feedback-based adaptive correction system that balances precision and productivity.
2Manufacturing precision
If actual position correction is performed frequently to maintain bonding accuracy, then positioning precision is improved, but time loss increases
Solution Approach 1:
The system applies actual position correction only partially - specifically when the cumulative correction amount exceeds a predetermined threshold - rather than performing it frequently or continuously. This selective correction approach minimizes time loss while maintaining bonding accuracy by intervening only when positioning drift becomes significant.
Solution Approach 2:
The system performs mark correction at every prescribed timing as a preliminary action to track cumulative positioning drift. This continuous monitoring prepares the system to trigger actual position correction only when necessary, preventing excessive correction operations and reducing time loss while maintaining precision.
3Measurement precision
If mark correction is performed at every prescribed timing to track positioning drift, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The position detection camera serves multiple functions: it performs mark correction to measure positioning drift, detects actual bonding positions, and provides data for cumulative correction amount calculation. This multi-functionality improves measurement precision while avoiding the need for separate dedicated measurement devices, thereby controlling device complexity.
Solution Approach 2:
The system merges the mark correction function with the actual position correction function, using the same position detection camera and control unit for both operations. This consolidation improves measurement precision through continuous monitoring while reducing device complexity by eliminating redundant components and simplifying the control architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces positional deviations in the bonding process, improving bonding quality while maintaining productivity by optimizing the timing of actual position corrections.
Implementation Method 1
a position detection camera are mounted, configured to move in at least one direction... imaging the reference mark using the position detection camera... detecting an actual bonding position of the semiconductor element after bonding using the position detection camera
Data Source
AI summary
A bonding apparatus and method for correcting movement amount of bonding head are provided. The bonding apparatus performs: mark correction of imaging a reference mark using a position detection camera at every prescribed timing and correcting the amount of movement of a bonding head on the basis of the amount of positional deviation between the position of the imaged reference mark and a reference position of the position detection camera; and actual position correction of detecting the actual bonding position of a semiconductor element after bonding using the position detection camera at every timing when the cumulative value of the amounts of correction of the mark correction from the previous actual position correction exceeds a prescribed first threshold and correcting the amount of movement of the bonding head on the basis of the amount of positional deviation between the detected actual bonding position and a target bonding position.