Bonding Head Edge Rotation for Precise Chip-to-Substrate Alignment

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Solution Overview

Problem

Existing semiconductor manufacturing methods face challenges in efficiently bonding semiconductor chips to substrates without the use of adhesive media, particularly in achieving precise alignment and stable attachment for high-density stacking and reduced electrical connection paths.

Innovation Solution

A semiconductor manufacturing apparatus is designed with a bonding head that includes an attachment pad capable of rotating around the edge of a semiconductor chip, allowing for precise alignment and contact with a substrate, and utilizing vacuum adsorption or electrostatic support to secure the chip during bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a direct bonding method is used without adhesive medium, then manufacturing precision and electrical connection length are improved, but alignment difficulty and operation complexity increase

Engineering Contradiction:

Improvealignment precisionVSAvoidalignment difficulty

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The patent introduces an attachment pad as an intermediary component between the bonding head and the semiconductor chip. This pad provides a stable attachment interface that facilitates precise positioning and alignment during the direct bonding process, thereby improving alignment precision while maintaining the benefits of adhesive-free bonding.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces traditional mechanical alignment methods with a combination of attachment pad positioning and rotation control. The attachment pad is configured to rotate around an axis passing through the chip edge, enabling precise angular adjustment and alignment without complex mechanical positioning systems.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If the attachment pad rotates around the chip edge, then alignment precision is improved, but device complexity increases

Engineering Contradiction:

Improvealignment precisionVSAvoidbonding head complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The bonding head is segmented into distinct functional components: the attachment pad, the rotation mechanism, and the support structure. The attachment pad is specifically designed to rotate around an axis passing through the chip edge, allowing independent control of alignment and bonding operations. This segmentation enables precise alignment functionality while keeping each component relatively simple in design.

Inventive Principle:

Principle #1Segmentation

3Productivity

If direct bonding is performed without adhesive film, then productivity is improved, but reliability of bonding decreases

Engineering Contradiction:

Improvebonding speedVSAvoidbonding stability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent implements preliminary actions before the actual bonding process: the attachment pad is first positioned and rotated to achieve precise alignment, then the chip is brought into contact with the substrate. This preliminary alignment phase ensures that direct bonding occurs at the correct position and orientation, thereby improving bonding reliability while maintaining high productivity through the elimination of adhesive application steps.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables direct bonding of semiconductor chips to substrates with improved alignment and stability, facilitating higher-density stacking and reduced electrical connection lengths, thereby enhancing signal processing speed and efficiency.

Implementation Method 1

the attachment pad is configured to rotate around an axis that passes through the portion of the edge of the semiconductor chip in contact with the substrate

Methodology Applied

Scientific EffectRotation:

Implementation Method 2

a vertical movement actuator configured to lower the attachment pad such that a portion of an edge of the semiconductor chip comes into contact with a top surface of the substrate

Methodology Applied

Scientific EffectMechanical movement:

Implementation Method 3

the parallel rotation actuator configured to rotate the lower body with respect to the upper body, which is stationary, by changing a length of the parallel rotation actuator in a lateral direction

Methodology Applied

Scientific EffectLateral expansion/contraction:

Data Source

PatentUS20250385109A1Semiconductor manufacturing apparatus including bonding head

Publication Date: 2025.12.18 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor manufacturing apparatus configured to bond a semiconductor chip to a substrate includes a bonding head configured to transfer the semiconductor chip such that the semiconductor chip is stacked on the substrate, the bonding head including an attachment pad configured to attach the semiconductor chip thereto and a vertical movement actuator configured to lower the attachment pad such that a portion of an edge of the semiconductor chip comes into contact with a top surface of the substrate. The attachment pad is configured to rotate around an axis passing through the portion of the edge of the semiconductor chip in contact with the substrate.