Bonding Head Alignment Using Fiducial Imaging for TSV Chip Bonding
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Solution Overview
Problem
In semiconductor device manufacturing, high precision is required for chip bonding operations such as flip chip and TSV (through silicon via) bonding, where sub-micrometer precision is necessary, and minute changes in mechanical/thermal structures can impair bonding precision, especially due to the use of high temperature and high pressure.
Innovation Solution
An apparatus and method involving a bonding head, camera, optical system, and fiducial mark to correct the positional relationship between semiconductor chips and substrates using images captured by the camera through the optical system, allowing for precise alignment and bonding with sub-micrometer accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high temperature and high pressure are used during chip bonding, then bonding strength is improved, but bonding precision deteriorates due to minute changes in mechanical/thermal structure
Solution Approach 1:
The patent performs image capture and position correction before the bonding process. The camera captures images of the chip and substrate, and the controller calculates correction values for positional deviations. This preliminary positioning ensures that even when high temperature and pressure are applied during bonding, the initial precision is maintained, preventing bonding precision deterioration.
Solution Approach 2:
The patent replaces mechanical positioning methods with an optical imaging system. Instead of relying solely on mechanical alignment mechanisms that are sensitive to thermal expansion and pressure changes, the system uses a camera to capture images and a controller to calculate positional corrections based on captured images, thereby substituting mechanical precision maintenance with optical measurement and computational correction.
2Manufacturing precision
If sub-micrometer precision is required for TSV chip bonding, then bonding quality is improved, but the complexity of the apparatus increases due to need for high precision components
Solution Approach 1:
The patent introduces an optical system as an intermediary between the bonding head and the control system. The camera captures images of the chip and substrate positions, and the controller uses these images to calculate positional deviations and generate correction values. This intermediary optical measurement system enables sub-micrometer precision without requiring the entire bonding apparatus to be mechanically precise to the same degree.
Solution Approach 2:
The patent creates optical copies (images) of the chip and substrate positions using a camera. Instead of directly manipulating physical positions with high precision mechanical components, the system captures images of the positions, processes these image data to determine deviations, and then applies corrections. This copying approach allows precision measurement and correction without requiring the entire apparatus to be built with sub-micrometer mechanical precision.
3Device complexity
If a single camera is used to capture both chip and substrate images, then device complexity is reduced, but measurement precision may be affected by camera movement
Solution Approach 1:
The patent merges the functions of capturing chip position and substrate position into a single camera system. The camera is mounted on the bonding head and captures images of both the chip being held and the substrate on the bonding stage. By using one camera instead of two separate cameras, the system reduces device complexity while maintaining measurement precision through software-based correction of any camera movement.
Solution Approach 2:
The patent implements a feedback mechanism where the single camera captures images, the controller calculates positional deviations based on these images, and correction values are applied to adjust the positioning. The system continuously monitors positions through image capture and uses the captured image data as feedback to correct any deviations, thereby maintaining measurement precision despite camera movement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-precision semiconductor device manufacturing by accurately aligning and bonding semiconductor chips on substrates, improving the precision and reliability of the chip bonding process, particularly in flip chip and TSV technologies.
Implementation Method 1
an optical system configured to transmit light between the mounting component and the camera so that the image of the mounting component held by the bonding head is captured by the camera
Implementation Method 2
a bonding head configured to adsorb and hold a mounting component at a pick-up position
Data Source
AI summary
An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.