Bonding Head Inclination Adjustment for Precise Die Alignment
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Solution Overview
Problem
Existing semiconductor chip bonding technologies face challenges in achieving precise positional and postural alignment with the circuit board, leading to potential electrical connection failures and physical damage due to misalignment, which decreases the yield in die bonding operations.
Innovation Solution
A bonding apparatus and method that includes a bonding head with an adjustable inclination mechanism and a conforming jig to align the chip holding surface accurately with the substrate, utilizing passive or active inclination adjustments based on inclination information to ensure parallel alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the chip holding surface is pressed against the conforming surface to adjust inclination, then the alignment precision between chip and substrate is improved, but the complexity of the bonding head adjustment mechanism increases
Solution Approach 1:
The conforming jig acts as an intermediary between the chip holding surface and the substrate. It includes a conforming surface that can be pressed against the chip holding surface to adjust its inclination, serving as a mediator that transfers and adjusts the angular relationship between components without requiring complex direct adjustment mechanisms.
Solution Approach 2:
The chip holding surface itself is made adjustable in inclination through the conforming jig mechanism. By pressing the chip holding surface against the conforming surface, the system enables self-adjustment of the bonding head's angle, allowing the component to service its own alignment needs without external complex intervention.
2Reliability
If the inclination of the chip holding surface is adjusted to match the substrate, then the yield of die bonding operation is improved, but the time required for adjustment increases
Solution Approach 1:
The conforming jig is pre-configured with a conforming surface that can be pressed against the chip holding surface to establish the correct inclination. This preliminary preparation of the adjustment mechanism allows for rapid alignment without requiring time-consuming manual calibration or complex multi-step adjustment procedures.
Solution Approach 2:
The inclination angle of the chip holding surface is adjusted as a controllable parameter through the conforming jig. By changing this angular parameter to match the substrate's inclination, the system achieves optimal bonding conditions quickly, improving yield without excessive adjustment time.
3Manufacturing precision
If the bonding head inclination is adjusted according to stage inclination information, then the posture alignment between chip and substrate is improved, but the complexity of the control system increases
Solution Approach 1:
The system utilizes inclination information about the stage as feedback to adjust the bonding head's inclination accordingly. The conforming jig receives this information and adjusts the chip holding surface angle to compensate for stage inclination variations, creating a feedback loop that maintains accurate alignment without requiring complex active control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the yield of die bonding operations by ensuring precise alignment and uniform pressing and heating distribution, reducing the risk of electrical failures and physical damage.
Implementation Method 1
a chip holding surface for holding the chip part by suction
Data Source
AI summary
A bonding apparatus comprises a chip holding part that disposes a chip part onto a substrate that has been placed on a substrate stage. The bonding apparatus adjusts the inclination of a chip holding surface that releasably holds the chip part. The bonding apparatus comprises: an adjustment controller which stores inclination information pertaining to inclination respectively for locations on a stage main surface having the substrate placed thereon; and a conforming jig which has a conforming surface onto which the chip holding surface is pressed, and in which the inclination of the conforming surface can be changed such that the inclination of the chip holding surface corresponds to the inclination indicated by the inclination information.