Bonding Head Sealing Structure for Uniform NCF Fillets
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Solution Overview
Problem
In semiconductor packaging, the thermal compression bonding process often results in varying sizes of non-conductive film fillets when stacking semiconductor chips, leading to inconsistent packaging and the need for excessive cutting to achieve uniformity.
Innovation Solution
A semiconductor chip bonding device with a sealing member that includes an upper and lower sealing member, where the lower sealing member is movable and has a height of 1.2 times the combined height of the semiconductor chip and non-conductive film, allowing for controlled formation of uniform non-conductive film fillets by moving independently to prevent excessive extrusion and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a bonding head is used for thermal compression bonding, then bonding between pads can be performed, but the non-conductive film fillet size varies depending on the number of stacked chips
Solution Approach 1:
The patent employs a movable sealing member that can dynamically adjust its position in the vertical direction to match different stack heights. The sealing member includes a movable lower sealing member that independently moves relative to the bonding head, allowing the system to adapt to varying numbers of stacked chips while maintaining consistent NCF fillet formation.
Solution Approach 2:
The sealing member is divided into multiple independent parts: an upper sealing member and a lower sealing member. The lower sealing member can move independently relative to the upper sealing member and the bonding head, allowing segmented control over the bonding process to maintain consistent fillet sizes across different stacking configurations.
2Adaptability or versatility
If the NCF fillet size varies with stack height, then stacking flexibility is maintained, but additional cutting processes are required to achieve uniformity
Solution Approach 1:
The sealing member is configured to preliminarily control and define the NCF fillet shape during the bonding process itself. By establishing the correct fillet geometry upfront through the sealing member's structure and movement, the need for subsequent cutting operations is eliminated, simplifying the overall manufacturing process.
3Manufacturing precision
If the sealing member height is increased to prevent excessive NCF extrusion, then fillet control improves, but damage to the substrate may occur
Solution Approach 1:
The lower sealing member moves independently in the vertical direction, allowing dynamic adjustment of the sealing height. This enables the system to apply appropriate sealing pressure to control NCF extrusion without excessive force that could damage the substrate, adapting to different bonding conditions in real-time.
Solution Approach 2:
The sealing member applies localized sealing force only where needed at the bonding interface. The movable lower sealing member provides targeted control over the NCF extrusion region without applying excessive pressure to the entire substrate area, preventing substrate damage while maintaining fillet control.
Data Source
AI summary
A semiconductor chip bonding device may include a substrate support, a bonding head moveable in a first direction toward the substrate support, and a sealing member disposed on the bonding head and surrounding a circumferential surface of the bonding head and extending in the first direction from the bonding head toward the substrate support and movable in the first direction.