Bonding Head Camera Offset Calibration for Faster Chip Alignment
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Solution Overview
Problem
Conventional bonding methods for calculating the change amount in the offset distance between a bonding tool and a camera system are time-consuming due to sequential detection processes for the reference mark and chip positions.
Innovation Solution
A bonding apparatus with a movable bonding head, a first camera, a second camera, and a reference member with a reference mark, where the calculation part determines the change amount in the offset distance by simultaneously detecting the reference mark and chip positions using both cameras, allowing for simultaneous detection and reduced processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sequential detection processes are used to calculate the change amount in offset distance, then measurement precision can be maintained, but the process time becomes excessively long
Solution Approach 1:
The patent combines the detection of the reference mark (first detection) and the chip position (second detection) into a single simultaneous detection process. By using two cameras to capture images at the same time and processing both positions together to calculate the offset distance change, the patent eliminates the sequential nature of the previous method, thereby reducing process time while maintaining measurement precision through coordinated multi-camera detection and integrated calculation processing.
2Measurement precision
If multiple separate processes are used to detect reference mark and chip position, then detection accuracy is improved, but device complexity increases
Solution Approach 1:
The patent implements a multi-functional detection system where two cameras work together in a coordinated manner. The first camera detects the reference mark while the second camera detects the chip position, and both detection functions are integrated into a single calculation process that determines the offset distance change. This universal approach allows the system to perform multiple detection tasks simultaneously through a unified detection and calculation mechanism, reducing overall system complexity while maintaining high detection accuracy.
Data Source
AI summary
A bonding apparatus includes: a movable bonding head part that holds a top camera and a bonding tool disposed at an offset distance from the top camera; a bottom camera capable of photographing the bonding head part; a reference member having a reference mark and fixed to a position that is at a predetermined distance from the bottom camera; and a calculation part that calculates a change amount in the offset distance based on the predetermined distance, a position of the reference mark detected by the top camera, and a position of a chip detected by the bottom camera, when the bonding head part moves such that the reference mark is positioned in the field of view of the top camera and the chip held by the bonding tool is positioned in the field of view of the bottom camera.