Bonding Head Parallelism Adjustment via Spherical Copying Mechanism
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Solution Overview
Problem
Conventional semiconductor device manufacturing techniques face challenges in accurately adjusting the bonding head's holding surface to be parallel to the substrate's mounting surface due to friction and other influences, leading to incomplete parallelism.
Innovation Solution
A manufacturing apparatus and method utilizing a copying mechanism with a spherical surface on the bonding head and stage, where the controller adjusts the facing surface to be parallel by switching between free and locked states, allowing precise alignment through repeated pressing and locking operations to achieve high accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the holding surface is simply pressed against the mounting surface, then the adjustment procedure is simple, but the parallelism accuracy is insufficient due to friction influence
Solution Approach 1:
The invention employs spherical surfaces (first spherical surface on the mounting surface and second spherical surface on the holding surface) instead of flat surfaces for the copying mechanism. This curvature enables precise angular adjustment and parallelism correction by allowing rotational movement around a fixed point, eliminating the friction-induced inaccuracies that occur with simple pressing of flat surfaces.
Solution Approach 2:
The copying mechanism creates a geometric copy of the mounting surface's orientation onto the holding surface through the spherical surface interaction. By making the holding surface parallel to the mounting surface via this copying action, the system achieves high parallelism accuracy without requiring complex measurement and adjustment procedures.
2Manufacturing precision
If the copying mechanism is used to adjust parallelism, then the parallelism accuracy can be improved, but the device complexity increases
Solution Approach 1:
The spherical surfaces provide a naturally constrained geometric relationship between the mounting and holding surfaces. The spherical geometry inherently guides the alignment process, reducing the need for additional complex control mechanisms while maintaining high parallelism accuracy.
Solution Approach 2:
The copying mechanism utilizes the spherical geometry and gravitational force to automatically achieve parallelism adjustment. The system self-corrects the alignment through the mechanical interaction of the spherical surfaces, eliminating the need for external measurement devices or complex control systems.
Data Source
AI summary
A manufacturing apparatus of a semiconductor device includes a stage, a bonding head, a copying mechanism mounted on the bonding head, and a controller executing adjustment processing. In the adjustment processing, the controller causes a facing surface of the bonding head to abut against a reference surface of the stage after setting the copying mechanism to a locked state, then presses the facing surface against the reference surface after switching the copying mechanism to a free state, and after that, switches the copying mechanism to the locked state.