Bonding Head Suction Segmentation for Semiconductor Chip Alignment
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Solution Overview
Problem
Conventional semiconductor chip bonding devices fail to effectively join bump electrodes on both sides of thin semiconductor chips due to suction issues, leading to poor bonding and potential chip breakage, especially with higher integration and central bump electrode configurations.
Innovation Solution
A semiconductor device fabricating method and apparatus that selectively attracts and positions semiconductor chips using multiple attraction regions on the reverse side, avoiding areas with reverse electrodes to prevent suction-induced stress and deformation, allowing for precise alignment and joining of obverse and reverse bump electrodes with the package substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a single suction hole is used to attract the semiconductor chip, then the chip can be held and conveyed, but the bump electrodes on the reverse side are directly sucked causing deformation and poor joining
Solution Approach 1:
The single suction hole is divided into multiple suction holes arranged in specific patterns. This segmentation allows different regions of the chip to be attracted with controlled force distribution, preventing direct suction on bump electrodes while maintaining effective chip holding and conveyance.
Solution Approach 2:
Different regions of the bonding head are designed with different suction characteristics. The suction holes are strategically positioned to create localized attraction zones that avoid bump electrode areas, ensuring that each region of the chip experiences appropriate suction force without causing deformation or misalignment.
2Length of moving object
If the semiconductor chip is made thinner to reduce size, then device integration is improved, but the chip becomes more susceptible to breaking under suction stress
Solution Approach 1:
Multiple suction holes are positioned to create a balanced distribution of suction forces across the chip surface. This counterbalancing approach prevents concentration of stress at any single point, allowing thin chips to be handled without exceeding their mechanical strength limits.
Solution Approach 2:
The suction force is distributed across multiple contact points rather than concentrated, providing a cushioning effect that protects the thin chip structure from sudden stress peaks that would cause breaking during handling and bonding operations.
3Adaptability or versatility
If bump electrodes are provided at both obverse and reverse sides for stacking, then chip stacking capability is improved, but the reverse side electrodes are directly sucked causing deformation
Solution Approach 1:
The suction system is segmented into multiple holes with specific positioning that creates attraction zones between the reverse electrodes. This segmentation allows the chip to be held firmly while maintaining the precise relative positioning of reverse electrodes, enabling accurate stacking operations.
Solution Approach 2:
The suction holes are arranged in a three-dimensional pattern within the bonding head, creating controlled attraction zones in space between the reverse electrodes. This spatial arrangement allows suction to be applied to the chip without directly contacting or deforming the electrode structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents poor joining and deformation of bump electrodes, reduces stress differences within the semiconductor chip, and ensures successful bonding without breaking, even for thin chips with electrodes on both sides.
Implementation Method 1
a bonding head 12, which has a plurality of suction holes 18 that pass-through the bonding head 12, is provided
Data Source
AI summary
Respective attracting openings of a bonding head are disposed so as to avoid joining regions at which bump electrodes (obverse electrodes) of a semiconductor chip are joined with bump electrodes of a package substrate. Bump electrodes (reverse electrodes) that are connected to the bump electrodes are provided at a reverse side of the semiconductor chip at positions opposing the bump electrodes. Because the attracting openings do not overlap the joining regions, the bump electrodes (reverse electrodes) are not suctioned at the joining regions.