Bonding Head Temperature Patterns for Precise Component Joining
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Solution Overview
Problem
Existing bonding techniques fail to achieve high-precision bonding of electronic components to substrates due to inadequate temperature control at the bonding head, which varies with component thickness, type, and orientation.
Innovation Solution
A bonding apparatus and method featuring a detachable pressure tool and heater with a controller that uses stored temperature control data to adjust the heater's temperature based on specific bonding conditions, allowing for precise temperature control patterns to be applied during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a cooling structure is used to control the bonding head temperature, then the bonding process can be completed, but high-precision bonding cannot be achieved for different bonding conditions
Solution Approach 1:
The patent applies dynamics by making the temperature control system adjustable and adaptable to different bonding conditions. The bonding head temperature control is dynamically modified to accommodate variations in electronic component thickness, electrode type, bonding material type, and component orientation, enabling precise temperature management for each specific bonding scenario.
Solution Approach 2:
The patent implements parameter changes by modifying the temperature control parameters of the bonding head based on different bonding conditions. By adjusting temperature parameters according to component thickness, electrode type, bonding material, and orientation, the system achieves high-precision bonding adapted to each specific condition rather than using a fixed temperature control approach.
2Manufacturing precision
If the bonding head temperature is controlled for general bonding, then the basic bonding process works, but precision bonding for specific conditions fails
Solution Approach 1:
The patent applies local quality by tailoring the temperature control to the specific local bonding conditions. Different temperature parameters are applied based on the particular characteristics of each bonding scenario (component thickness, electrode type, bonding material, orientation), ensuring that each bonding operation receives the precise temperature control it requires for successful completion.
3Adaptability or versatility
If a fixed temperature control system is used, then the system is simple to operate, but it cannot adapt to different electronic component bonding conditions
Solution Approach 1:
The patent implements preliminary action by pre-establishing the temperature control system's capability to handle different bonding conditions. The system is designed in advance to accommodate various component thicknesses, electrode types, bonding materials, and orientations, so that when bonding operations are performed, the appropriate temperature parameters are already in place without requiring complex real-time adjustments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-precision bonding by accurately controlling the temperature and pressure of the bonding head according to the electronic component's conditions, ensuring reliable joining between the component and substrate.
Implementation Method 1
a heater that heats the pressure tool
Implementation Method 2
the bonding head is cooled so that the solder or adhesive is also cooled and fixed
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A bonding apparatus 1 comprises: a bonding head 2 including a pressure tool PT that pressurizes an electronic component 9 and a heater 22 that heats the pressure tool PT, the pressure tool PT being configured so as to be detachable from the heater 22; a storage unit 5 that stores temperature control data indicating temporal changes in the set temperature of the heater 22; and a control unit 4 that controls the set temperature of the heater 22 on the basis of the temperature control data. The temperature control data has one or more temperature control patterns associated with bonding conditions for bonding the electronic component 9 to a substrate 8. The control unit 4 reads one of the one or more temperature control patterns according to the bonding conditions and controls the set temperature of the heater 22.