Bonding Head Tilt Correction for Precise Substrate Mounting
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Solution Overview
Problem
Existing methods for mounting components on a substrate often interrupt processing due to components not being aligned parallel to the substrate, leading to increased costs, weight, and complexity in inclination control solutions for bonding heads.
Innovation Solution
The solution involves tilting the contact surface using existing drives and/or actuators, enabling simplified tilt correction with a mechanism comprising engagement members, adjustment members, and tilt position blocks, which can be passive, thus reducing complexity and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If inclination control solutions are added to the bonding head, then component alignment precision is improved, but device complexity and weight increase
Solution Approach 1:
The patent extracts the inclination control function from the bonding head by using a separate, adjustable mounting bracket that can tilt the bonding head relative to the substrate holder. This separates the alignment function from the bonding head structure, reducing bonding head complexity while maintaining alignment precision through the adjustable bracket mechanism.
Solution Approach 2:
The mounting bracket is pre-adjusted to the required inclination angle before bonding operations begin. This preliminary adjustment allows the bonding head to maintain precise alignment throughout operation without requiring complex active control mechanisms during the bonding process itself.
2Manufacturing precision
If active inclination control mechanisms are added to the bonding head, then alignment precision is improved, but weight increases
Solution Approach 1:
The inclination control function is extracted from the bonding head and implemented through a separate adjustable mounting bracket. This passive mechanical adjustment mechanism is significantly lighter than active control systems with motors and sensors, reducing bonding head weight while maintaining alignment precision.
3Manufacturing precision
If complex inclination control systems are implemented, then alignment precision is improved, but processing speed decreases due to interruptions
Solution Approach 1:
The mounting bracket is adjusted to the correct inclination angle during setup or maintenance periods, not during active bonding operations. This preliminary adjustment eliminates the need for continuous or frequent alignment checks and corrections during production, maintaining high processing speed while ensuring alignment precision.
Solution Approach 2:
The adjustable mounting bracket is designed to maintain its set inclination angle automatically during bonding operations without requiring active control or intervention. The mechanical structure self-maintains the alignment, eliminating processing interruptions while preserving alignment precision.
Data Source
AI summary
An apparatus and method for mounting devices on a substrate. Processing is often interrupted during operation because the components are not provided for assembly parallel to the substrate. Inclination control solutions increase the cost, weight and complexity of the bonding head. By tilting the contact surface using existing drives and/or actuators, simplified tilt correction is made possible, providing high throughput and high reliability. The tilt correction mechanism consists of one or more engagement members, one or more adjustment members and one or more tilt position blocks. In some cases, passive elements and mechanisms may be used.