Bonding Head Pressure Switching to Prevent Die Bonding Voids
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving high integration density and reliable packaging of semiconductor dies due to voids formed between the die and the wafer structure during bonding, which affect yield and reliability.
Innovation Solution
A bonding apparatus with a bonding head that includes vacuum channels and switchable channels, controlled by a controller, is used to warp and then flatten the integrated circuit die on the wafer structure, reducing or preventing voids through controlled vacuum and blowing modes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods are used to bond semiconductor die to wafer structure, then bonding process is simple, but voids form between die and wafer structure reducing yield and reliability
Solution Approach 1:
The patent applies preliminary action by pre-warping the semiconductor die using a protrusion on the bonding head before the actual bonding process. This pre-deformation prepares the die to conform to the wafer structure surface, preventing void formation during bonding. The die is deliberately deformed in advance to match the target surface geometry, ensuring complete contact during subsequent bonding operations.
Solution Approach 2:
The patent utilizes curvature by employing a protrusion on the bonding head that applies localized pressure to warp the die into a curved shape. This curvature matches the convex surface geometry of the wafer structure, allowing the die to conform to the non-planar bonding surface. The controlled deformation creates a curved die profile that eliminates gaps and voids during bonding.
2Manufacturing precision
If vacuum channels are used to hold die on bonding head, then die positioning is stable, but die warpage control is limited
Solution Approach 1:
The protrusion performs preliminary warping action on the die while it is held by the vacuum channels. The vacuum maintains stable positioning and prevents die displacement during the warping process, while the protrusion simultaneously deforms the die into the desired curved shape. This combination ensures both precise positioning and controlled warpage preparation before bonding.
Solution Approach 2:
The protrusion acts as an intermediary element between the vacuum bonding head and the die. It provides localized mechanical contact to warp the die surface while the vacuum channels provide overall positioning stability. The intermediary protrusion enables controlled deformation without compromising the stable holding provided by the vacuum system.
3Reliability
If die is bonded directly without warping, then bonding process is fast, but voids form reducing bonding quality
Solution Approach 1:
The warping action is performed as a preliminary step integrated into the bonding process. The protrusion warps the die quickly during the approach phase before final contact, so that when bonding occurs, the die is already pre-formed to match the wafer structure. This eliminates the need for separate warping steps and maintains high productivity while ensuring bonding quality.
4Reliability
If multiple bonding steps are used to eliminate voids, then void reduction is effective, but process complexity increases
Solution Approach 1:
The patent performs the void-prevention action in advance by warping the die before bonding. This single preliminary warping step replaces multiple subsequent bonding adjustments that would otherwise be needed to eliminate voids. The die is pre-formed to match the bonding surface geometry, ensuring complete contact from the start and eliminating the need for iterative bonding steps.
Solution Approach 2:
By using curvature to pre-form the die surface to match the convex wafer structure, the patent eliminates void formation at the source. This geometric matching approach replaces complex multi-step bonding processes with a single streamlined operation where the curved die naturally conforms to the bonding surface without requiring subsequent void-elimination steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the yield and reliability of integrated circuit packages by minimizing voids between the die and the wafer structure, ensuring better contact and bonding quality.
Implementation Method 1
a vacuum pump; a bonding head, wherein the bonding head includes a main body; a first vacuum channel in the main body, wherein the first vacuum channel is connected to the vacuum pump
Implementation Method 2
a blower; a first switchable channel in the main body, wherein the first switchable channel is connected to the vacuum pump and the blower
Data Source
AI summary
A bonding apparatus with a bonding head having vacuum channels and switchable channels, and the method of forming the same are provided. The bonding apparatus may include a vacuum pump, a blower, a controller communicatively coupled to the vacuum pump and the blower, and a bonding head. The bonding head may include a main body, a first vacuum channel in the main body, wherein the first vacuum channel is connected to the vacuum pump, and a first switchable channel in the main body, wherein the first switchable channel is connected to the vacuum pump and the blower.