Bonding Flexible Parts With Inclined Leads Using Rotating Support Bracket
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for bonding electronic parts to substrates assume a horizontal alignment, which is inadequate for situations where the substrate and electronic part are tilted relative to each other, necessitating a novel method for aligning and bonding parts with inclined leads.
Innovation Solution
A method involving a support bracket system with rotating and translating units to align inclined leads of a first part with inclined pads on a second part, using a bonding head to bond the leads to the pads while adjusting the angle and position of both parts for effective bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional horizontal bonding methods are used, then the bonding process is simple, but it cannot accommodate inclined leads and tilted substrates
Solution Approach 1:
The patent employs a rotatable support bracket that can dynamically adjust the orientation angle to match inclined leads, and a movable fixing member that can translate along the bracket to accommodate different positions. This dynamic adjustment capability enables the system to adapt to various inclination angles and positions, resolving the contradiction between adaptability and device complexity by making the alignment system flexible rather than fixed
Solution Approach 2:
The support bracket serves multiple functions: it provides rotational adjustment for angle alignment, translational movement for position adjustment, and structural support for the fixing member. This multi-functionality consolidates what would otherwise require separate alignment devices into a single integrated system, improving adaptability while controlling overall device complexity
2Manufacturing precision
If manual alignment methods are used for inclined leads, then the equipment is simple, but alignment precision is insufficient
Solution Approach 1:
The patent replaces manual visual alignment with an automated imaging system that captures images of the inclined leads and substrate, processes the images to determine precise positions and angles, and automatically controls the movement and rotation of the fixing member and support bracket. This substitution of mechanical manual operations with automated image-based control achieves high alignment precision while maintaining reasonable automation levels
Solution Approach 2:
The imaging system creates a digital copy or representation of the physical inclined leads and substrate positions, allowing the system to analyze and plan the alignment path before executing the bonding operation. This copying approach enables precise measurement and calculation of alignment parameters without physically disturbing the components
3Adaptability or versatility
If the bonding head is fixed in position, then the device structure is simple, but it cannot bond inclined leads effectively
Solution Approach 1:
Instead of making the bonding head movable and complex, the patent keeps the bonding head fixed and instead makes the support bracket rotatable and the fixing member translatable. This dynamic repositioning of the workpiece (inclined lead) relative to the fixed bonding head achieves the same effect with simpler overall system design, as it is easier to move and rotate the bracket assembly than to reposition a precision bonding head
Data Source
AI summary
A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.