Bonding Interface Filter Circuit for Semiconductor Integration
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Solution Overview
Problem
Conventional electronic systems face challenges in integrating passive components like filters efficiently, leading to increased space occupation and costs due to the use of discrete passive components on system boards and packages, which hinders the miniaturization and performance of electronic devices.
Innovation Solution
The integration of passive components such as resistors, capacitors, and inductors into the interface structure between bonded semiconductor elements, eliminating the need for separate components on the device die or package substrate by using direct bonding techniques without adhesives, allowing for the formation of filters within the bonding interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete passive components are mounted on system board or package substrate, then filtering function is achieved, but device size and space occupation increase
Solution Approach 1:
The patent merges the bonding interface structure with the filter circuit by forming conductive features and dielectric layers directly at the bonding interface between semiconductor elements. This integration eliminates the need for separate discrete passive components on the system board or package substrate, thereby achieving the filtering function while minimizing device size.
2Reliability
If discrete passive components are used for signal filtering, then filtering performance is achieved, but manufacturing cost increases
Solution Approach 1:
The bonding interface is combined with the filter circuit structure, allowing the filter to be formed as an integral part of the bonding process. This eliminates the need for separate discrete passive components and reduces assembly steps, thereby lowering manufacturing costs while maintaining signal filtering performance.
Solution Approach 2:
The bonding interface serves dual functions: providing mechanical and electrical connection between semiconductor elements while simultaneously forming the filter circuit. This multi-functionality reduces the total component count and simplifies the overall structure, leading to cost reduction.
3Strength
If adhesive is used in bonding process, then mechanical bonding is achieved, but filter circuit integration is compromised
Solution Approach 1:
The adhesive layer is completely removed from the bonding interface, and mechanical bonding is achieved through direct bonding of the semiconductor elements. This extraction of the adhesive enables the conductive and dielectric features to be formed directly at the bonding interface without interference, facilitating filter circuit integration.
Data Source
AI summary
A stacked and electrically interconnected structure is disclosed. The structure can comprise a first element and a second element directly bonded to the first element along a bonding interface without an intervening adhesive. A filter circuit can be integrally formed between the first and second elements along the bonding interface.