Bonding Layer Evaluation via Double Through-Transmission Ultrasonic Analysis

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Solution Overview

Problem

Conventional methods for detecting bonding defects in bonding layers cannot identify weak bonds without breaking the sample, and existing technologies require sample destruction to assess bond strength.

Innovation Solution

A bonding layer evaluation system that uses an elastic wave generation device, reflection body, detection device, and control unit to evaluate bonding layers by comparing actual and theoretical elastic wave parameters, specifically employing ultrasonic waves and frequency analysis to detect weak bonds without sample destruction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional ultrasonic reflection detection is used, then void spaces at the bonding layer can be detected, but weak bonds without void spaces cannot be detected

Engineering Contradiction:

Improvedetection capabilityVSAvoidweak bond detection accuracy

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

An elastic wave reflection body is introduced as an intermediary element to create a double through-transmission wave path. This mediator enables the ultrasonic wave to interact with the bonding layer twice, enhancing the detection of weak bonds without requiring direct contact or breaking the sample.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The ultrasonic wave is made to pass through the bonding layer repeatedly by reflecting off the elastic wave reflection body. This periodic action through double transmission amplifies the detection sensitivity for weak bonds, allowing accumulation of detection information without sample destruction.

Inventive Principle:

Principle #19Periodic action

2Measurement precision

If sample breaking is performed to detect weak bonds, then bond strength can be assessed, but the sample is destroyed and cannot be reused

Engineering Contradiction:

Improvebond strength assessment accuracyVSAvoidsample destruction

Core Design Contradiction:

Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The mechanical breaking method is replaced with an acoustic field-based detection system. Ultrasonic waves and elastic wave reflection are used to non-destructively assess bond strength, substituting physical destruction with wave-based measurement that preserves the sample.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system achieves multiple detection capabilities (void detection, weak bond detection, bond strength assessment) using a single non-destructive ultrasonic measurement approach, eliminating the need for separate destructive testing procedures.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If theoretical model comparison is used for evaluation, then weak bonds can be detected without breaking the sample, but the system complexity increases

Engineering Contradiction:

Improvenon-destructive weak bond detectionVSAvoidsystem structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

A theoretical model is prepared in advance to represent the expected ultrasonic wave behavior through the bonding layer. This preliminary theoretical framework enables direct comparison with actual measurements, simplifying the detection process while maintaining non-destructive evaluation capability.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system compares actual ultrasonic wave measurements with theoretical model predictions, using this feedback to evaluate bonding quality. The comparison mechanism provides quantitative assessment of weak bonds while maintaining system simplicity through established theoretical frameworks.

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables non-destructive evaluation of bonding layers, accurately detecting weak bonds through double through-transmission wave analysis, providing high accuracy in assessing bonding properties and quantifying bond strength.

Implementation Method 1

an ultrasonic wave emission device 11 configured to emit an ultrasonic wave to the sample 1; an ultrasonic wave detection device 12 configured to detect reflected ultrasonic waves

Methodology Applied

Scientific EffectUltrasonic wave emission and detection: Ultrasound

Implementation Method 2

an elastic wave reflection body configured to reflect the elastic wave generated from the sample

Methodology Applied

Scientific EffectElastic wave reflection: Reflection

Data Source

PatentUS12019049B2Bonding layer evaluation system and bonding layer evaluation method

Publication Date: 2024.06.25 MITSUBISHI HEAVY IND LTD

AI summary

A bonding layer evaluation system includes an elastic wave generation device configured to generate an elastic wave from a sample including a bonding layer; an elastic wave reflection body configured to reflect the elastic wave generated from the sample; a sample installation unit provided between the elastic wave generation device and the elastic wave reflection body; an elastic wave detection device disposed in a direction in which the elastic wave is reflected by the elastic wave reflection body, and configured to detect the reflected elastic wave; and a control device configured to evaluate a parameter related to the bonding layer. The control device evaluates the parameter related to the bonding layer by comparing the actual value of the elastic wave detected by the elastic wave detection device with a theoretical value of the elastic wave calculated based on a theoretical model related to the sample.