Multidirectional Bonding Layer for Low-Shock Payload Separation

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Solution Overview

Problem

Existing connection devices for payloads and dispensers in aerospace applications suffer from high shock induction and significant reaction time dispersion during separation, making them inefficient for simultaneous multi-payload releases.

Innovation Solution

A connection device featuring a multidirectional adhesive bonding layer and thermite heat-generating material, allowing for efficient load transmission and rapid separation with minimal shock, comprising a first and second base plate with connection walls and a bonding layer that extends in multiple directions, facilitating tension, compression, and shear loading.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional segmented retention nuts with fusible elements are used for connection, then the connection device can be disconnected on command, but the separation process induces powerful shocks and has high reaction time dispersion

Engineering Contradiction:

Improvecontrolled separationVSAvoidshock during release

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical separation mechanism (segmented retention nuts with fusible elements) with a thermal field-based mechanism. A pyrotechnic charge generates thermal energy that rapidly heats and degrades the adhesive bonding layer, causing separation. This substitution of mechanical action with thermal field action reduces shock and improves reaction time consistency.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical state and properties of the bonding layer through thermal parameter changes. The adhesive layer transitions from a high-strength bonded state to a degraded state through controlled thermal heating, enabling separation. This parameter change approach allows for more controlled and consistent separation compared to mechanical mechanisms.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If traditional segmented retention nuts are used for connection, then disconnection can be triggered on command, but the reaction time has significant dispersion

Engineering Contradiction:

Improveon-command disconnectionVSAvoidreaction time dispersion

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces the mechanical triggering mechanism with a thermal field-based separation mechanism. The pyrotechnic charge provides a more consistent and predictable energy delivery to the adhesive layer, resulting in reduced reaction time dispersion compared to mechanical fusible element melting.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs a controlled periodic action through the pyrotechnic initiation sequence, where the thermal energy is delivered in a consistent, repeatable manner to the adhesive layer. This periodic thermal action ensures uniform reaction time across multiple separation events, reducing dispersion.

Inventive Principle:

Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The connection device achieves rapid separation with low shock and reaction time dispersion, suitable for payloads like satellites and microsatellites, ensuring efficient load transmission and adaptation to various dispenser shapes, with reaction times under half a second and dispersion less than 10%.

Implementation Method 1

thermite that will cause heating of the adhesive layer on command to make it lose its adhesion capacity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heat-generating material arranged in the internal volume so as to heat the bonding layer by thermal conduction through the first connection wall

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 3

a bonding layer composed of a layer of adhesive material or a weld, formed in said space in contact with each of the first and second connection surfaces

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS11225340B2Local connection device with controlled separation comprising a multidirectional bonding layer

Publication Date: 2022.01.18 ARIANEGRP SAS

AI summary

To enable a local connection with separation on command, a connection device (20) comprises a first base plate (24), a first connection wall (22) forming a protuberance from the first base plate (24) and having an internal surface (22A) delimiting an internal volume (V) located on the side of the first base plate, on a first side, and a first connection surface (22B), a second base plate (28), a second connection wall (26) fixed to the second base plate on a second side and with a second connection surface (26A) covering the first connection wall (22) so as to form a space (S) between the first and second connection surfaces, a bonding layer (30) arranged in the space and extending along at least two distinct directions, and a heat generating material (32) arranged in an internal volume so as to enable heating of the bonding layer.